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Product Details:
Payment & Shipping Terms:
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| Product Name: | TIG780-10 | Color: | White |
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| Viscosity: | 1000K Cps @.25℃ | Specific Gravity: | 2.2 G/cm3 |
| Thermal Conductivity: | 1.0 W/mK | Evaporation: | 0.23% / 200℃@24hrs |
| High Light: | cpu thermal paste,heat sink grease,thermal conductive grease white for LED |
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1W Non Toxic Thermal Grease Conductivity White Safe for LED 0.15 ℃ - in² / W Thermal Resistance
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
The TIG™780-10 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the heat dissipation fins. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance. Consequently, the heat dissipation efficiency is far superior to that offered by others.
Features
| Low thermal resistance 0.15 ℃-in² /W |
| One component paste like interface material, never dry |
| Thermal compound formulated to maximize the heat transfer |
| Outstanding electrical insulation properties and will not harden on long exposure to elevated temperatures |
| Non-toxic and environmentally safe |
| Silicone-based materials conduct heat between a hot component and a heat sink or enclosure |
| Fills interface variable tolerances in electronics assemblies and heat sink applications |
| Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration |
| Thermally stable and require virtually no compressive force to deform under typical assembly pressures |
| Supports high power applications requiring material with minimum bond line thickness and high conductivity |
| Ideal for rework and field repair situations |
| Low bleed and evaporation |
Applications
| Semiconductor cases and heat sinks |
| Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices |
| CPUs and GPUs |
| Automatic dispensing and screen-printing |
| Mobile, desktop |
| Engine and transmission control modules |
| Memory modules |
| Power conversion equipment |
| Power supplies and UPS |
| Power semiconductors |
| Custom ASICS Chips |
| Integrated Gate Bipolar Transistors (IGBT) |
| Between any heat generating semiconductor and heat sink |
| Custom power modules |
| Telecommunications and automotive electronics |
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Typical Properties of TIG™780-10 Series
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Product Name
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TIGTM780-10
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Tese Method
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Color
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White paste
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Visual
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Construction &
Compostion |
Metal oxide filled silicone oil
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Viscosity
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1000K cps @.25℃
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Brookfield RVF,#7
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Specific Gravity
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2.2 g/cm3
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Continuos Use Temp
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-49℉ to 392℉ / -45℃ to 200℃
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*****
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Evaporation
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0.23% / 200℃@24hrs
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Thermal Conductivity
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1.0 W/mK
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ASTM D5470
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hermalImpedance
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0.15℃-in²/W @ 50 psi(344 KPa)
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ASTM D5469
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Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge
Contact Person: Dana
Tel: +8618153789196
