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0.95 W / mK Thermal Phase Changing Materials , Notebook Thermal Insulating Materials

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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0.95 W / mK Thermal Phase Changing Materials , Notebook Thermal Insulating Materials

0.95 W / mK Thermal Phase Changing Materials , Notebook Thermal Insulating Materials
0.95 W / mK Thermal Phase Changing Materials , Notebook Thermal Insulating Materials 0.95 W / mK Thermal Phase Changing Materials , Notebook Thermal Insulating Materials 0.95 W / mK Thermal Phase Changing Materials , Notebook Thermal Insulating Materials 0.95 W / mK Thermal Phase Changing Materials , Notebook Thermal Insulating Materials

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Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIC™808P
Payment & Shipping Terms:
Minimum Order Quantity: 1000PCS
Price: negotiation
Packaging Details: 1000pcs/bay
Delivery Time: 3-5days
Supply Ability: 100000pcs/day
Detailed Product Description
Product Name: Phase Changing Materials Color: Pink
Phase Transition Temperature: 50℃~60℃ Density: 2.2g/cc
Thickness: 0.127~0.25mmT Thermal Conductivity: 0.95 W/mK
Highlight:

heat absorbing materials

,

thermal insulating materials

,

Notebook Thermal Insulating Materials

0.95 W / mK Thermal Phase Changing Materials , Notebook Thermal Insulating Materials

 

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

  The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

 

     The TIC™800P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 


Features:


>  0.024℃-in² /W thermal resistance
>  Naturally tacky at room temperature, no adhesive required             
>  No heat sink preheating required 


Applications:
>  High Frequency Microprocessors
>  Notebook and Desktop PCs
>  Computer Serves
>  Memory Modules
>  Cache Chips
>  IGBTs

 

 

Typical Properties of TIC™800P Series
Product Name
TICTM803P
TICTM805P
TICTM808P
TICTM810P
Testing standards
Color

Pink

Pink
Pink Pink
Visual
Composite Thickness
0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance
±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density
2.2g/cc
  Helium  Pycnometer
Work temperature
-25℃~125℃
 
phase transition  temperature
50℃~60℃
 
Thermal conductivity
0.95 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)
0.021℃-in²/W
0.024℃-in²/W
0.053℃-in²/W
0.080℃-in²/W
ASTM D5470 (modified)
0.14℃-cm²/W
0.15℃-cm²/W
0.34℃-cm²/W
0.52℃-cm²/W
 
Standard Thicknesses:

0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                  
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)              
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive: 

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement: 

No reinforcement is necessary.
0.95 W / mK Thermal Phase Changing Materials , Notebook Thermal Insulating Materials 0
 
Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)