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3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling

3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling

Large Image :  3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-10F
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 100000pcs/day
Detailed Product Description
Products Name: 3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling Construction & Compostion: Ceramic Filled Silicone Elastomer
Thermal Conductivity: 3.0W/m-K Hardness: 60 Shore 00
Density: 3.1g/cm³ Continuos Use Temp: -40 To 200℃
Breakdown Voltage(V/mm): ≥5500 VAC Keywods: Thermal Conductive Pad
Highlight:

thermally conductive pad

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thermal conductive material

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Thermal Conductive Pad Compressible

3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity for Computer CPU/GPU Cooling

 
Products description
 
The TIF®100-30-10F Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.

Features
 

> Good thermal conductive 3.0 W/mK
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

> RoHS compliant
> UL recognized


Applications

 

> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
 
Typical Properties of TIF®100-30-10F Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.1 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 60 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

 

3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling 0

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

FAQ:

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)