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Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

Large Image : Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF100-50-11US

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/day

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Detailed Product Description

Prodcuts Name:	Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom	Application:	AI Processors, AI Servers, Smart Home, Telecom
Recommended Operating Temperature:	-40 To 200℃	Thermal Conductivity:	5.0W/m-K
Hardness:	65/20 Shore 00	Density:	3.2g/cm³
Color:	Dark Grey	Thickness:	0.010"(0.25mm)~0.200"(5.0mm)
Keywords:	Thermal Gap Pad

Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

The TIF^®100-50-11US Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filing of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal solutions and physical protection for the most precise and higt heat flux electronic components.

Features

> Good thermal conductive: 5.0W/mK
> Moldability for complex parts
> Easy release construction
> Electrically isolating
> High durability

Applications

Electronic Components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robotics, Servers, Smart Home, Telecom, etc.

Typical Properties of TIF^®100-50-11US Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.2		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.0)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @ 1MHz	6.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	5.0W/m-K		ASTM D5470
	5.0W/m-K		ISO22007

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.

Company profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.