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Products Name: | 1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs | Sample: | Sample Free |
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Thermal Conductivity: | 1.2W/m-K | Thickness: | 0.020"(0.5mm)~0.200"(5.0mm) |
Hardness: | 20±5 Shore 00 | Color: | Blue |
Specific Gravity: | 2.0g/cc | Application: | IGBTs |
Keywords: | Thermal Pad |
1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs
The TIF®100-12-05US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features
> Good thermal conductive: 1.2W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> RoHS compliant
> UL recognized
Applications
> Cpu heat sinking
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> Notebook
> Power supply
> Heat pipe thermal solutions
Typical Properties of TIF®100-12-05US Series | ||
Color | Blue | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ****** |
Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM D374 |
Specific Gravity | 2.0 g/cc | ASTM D297 |
Hardness | 20±5 Shore 00 | ASTM 2240 |
Operating Temp | -40 ~ 160℃ | ****** |
Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
Dielectric Constant @1MHz | 4.5 MHz | ASTM D150 |
Volume Resistivity | ≥1.0X1012 Ohm-cm | ASTM D257 |
Fire rating | 94 V0 | UL E331100 |
Outgassing(TML) | 0.40% | ASTM E595 |
Thermal conductivity | 1.2W/m-K | ASTM D5470 |
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Contact Person: Dana Dai
Tel: 18153789196