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1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

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1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs

1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs

Large Image :  1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-12-05US
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Products Name: 1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs Sample: Sample Free
Thermal Conductivity: 1.2W/m-K Thickness: 0.020"(0.5mm)~0.200"(5.0mm)
Hardness: 20±5 Shore 00 Color: Blue
Specific Gravity: 2.0g/cc Application: IGBTs
Keywords: Thermal Pad

1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs

 

The TIF®100-12-05US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


Features


> Good thermal conductive: 1.2W/mK 
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized


Applications


> Cpu heat sinking 
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Notebook
> Power supply
> Heat pipe thermal solutions

 

Typical Properties of TIF®100-12-05US Series
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ASTM D374
Specific Gravity 2.0 g/cc ASTM D297
Hardness 20±5 Shore 00 ASTM 2240
Operating Temp -40 ~ 160℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant @1MHz 4.5 MHz ASTM D150
Volume Resistivity ≥1.0X1012 Ohm-cm ASTM D257
Fire rating 94 V0 UL E331100
Outgassing(TML) 0.40% ASTM E595
Thermal conductivity 1.2W/m-K ASTM D5470

 

1.2W High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs 0

 

Company Profile
 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

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