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5G Computer Mobile Phone Thermal Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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5G Computer Mobile Phone Thermal Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials

5G Computer Mobile Phone Thermal Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials
5G Computer Mobile Phone Thermal Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials
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Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs and UL
Model Number: TIS807-09-01
Payment & Shipping Terms:
Minimum Order Quantity: 1000PCS
Packaging Details: 1000pcs/bag
Delivery Time: 2-3Work days
Supply Ability: 100000PCS/Day
Detailed Product Description
Products Name: 5G Computer Mobile Phone Thermal Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials Color: Gray
Construction & Compostion: Ceramic Filled Silicone Elastomer / Fiberglass Continuos Use Temp: -60 To 180℃
Volume Resistivity: >1.0X10¹² Ohm-cm Key Words: Thermal Insulation Materials
Thermal Conductivity: 0.9W/mK Density: 2.4 G/cc
Application: 5G Computer Mobile Phone Battery Elements
Highlight:

5G Thermal Conductive Interface Material

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Battery Elements Thermal Insulation Materials

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Thermal Conductive Interface Material Gap Filler

5G Computer Mobile Phone Thermal Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials

 

TIS®807-09-01 Series of products are highly efficient insulating products and they also have thermal conductivity. it achieves the effect of both insulation and heat conduction by adding insulating silicone base material to the heat-conducting material.

 

5G Computer Mobile Phone Thermal Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials 0

Features:
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures


Applications:
> Car Battery & Power Supply

> Power semiconductors
> Audio and Video components

> Motor controllers

Typical Properties of TIS®807-09-01 Series
Property Value Test Method
Color Gray Visual
Construction &Compostion Ceramic filled silicone elastomer /fiberglass ******
Thickness range 0.007inch (0.178mm) ASTM D374
Tensile Strength(MPa) 50 ASTM D412
Density 2.4 g/cc ASTM D297
Continuos Use Temp -60 to 180℃ ******
Breakdown Voltage(V/mm) 3500 ASTM D149
Dielectric Constant @ 1MHz 5.5 ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 0.9W/m-K ASTM D5470
Thermal impedance(℃-in²/W)@30psi 1.32 ASTM D5470

Standard Thicknesses

0.007inch (0.178mm)

 

Standard Sizes
12" x 160"(304mm x 48.76M)

The TlS series can be die-cut into different shapes and provided. lf you need different thicknesses, please contact our company.

5G Computer Mobile Phone Thermal Conductive Interface Material Gap Filler Battery Elements Thermal Insulation Materials 1

Packaging Details & Lead time

 

The packaging of silicone insulation materials

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 
Company profile
 
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

 

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)

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