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CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

CPU High Thermal Conductivity Die Cut Silicon Thermal Pad
CPU High Thermal Conductivity Die Cut Silicon Thermal Pad
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Large Image :  CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF760PUS thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Name: CPU High Thermal Conductivity Die Cut Silicon Thermal Pad Keyword: Thermal Interface Material
Applications: CPU PC GPU Material: Ceramic Filled Silicone Elastomer
Certification: UL Thermal Conductivity: 7.5W/m-K
Thickness: 1.5 MmT
Highlight:

Die Cut Silicon Thermal Pad

,

CPU Silicon Thermal Pad

,

High Thermal Conductivity Silicon Thermal Pad

CPU high thermal conductivity die cut silicon thermal pad

 

 

Ziitek TIF760HP is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

 

TIF700PUS-data sheet.pdf

 

 

CPU High Thermal Conductivity Die Cut Silicon Thermal Pad 0

 

Features

 

> Good thermal conductive: 7.5 W/mK

> Thickness: 1.5 mmT

> hardness:20

> Colour: gray

> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance

 

 

 

Applications

 

> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

 

 

Typical Properties of  TIF760HP  Series
Color
Blue
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

 3.2 g/cc 

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness

1.5mmT

***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

20

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity

 7.5W/mk

ASTMD5470
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
≥6000 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

 4.5MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
≥ 3.5X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

7.5 W/m-K

GB-T32064
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

CPU High Thermal Conductivity Die Cut Silicon Thermal Pad 1

 

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

 

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

 

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)