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Product Details:
Payment & Shipping Terms:
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| Certification: | UL | Name: | Wholesale Customized High Thermal Conductivity Adhesive Silicone Thermal Pads |
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| Applications: | GPU CPU Cooling | Thickness: | 4.5mmT |
| Material: | Silicone | Thermal Conductivity: | 7.0 W/m-K |
| Keyword: | Thermal Conductive Pad |
LTD Thermal Pad Thermal Conductive Pad Customized Silicone Thermal Insulation Sheet Thermal Pads for CPU
Ziitek TIF7180HZ use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features
> Good thermal conductive: 7.0 W/mK
> Thickness: 4.5mmT
> hardness:55±5
> Colour: Blue
> Easy release construction
> Electrically isolating
> High durability
Applications
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
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Typical Properties of TIF7180HZ Series
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Color
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Blue |
Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone elastomer
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
3.45 g/cc |
ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
4.5mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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55±5 |
ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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| Thermal conductivity |
7.0W/mk
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ASTMD5470
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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***
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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4.5MHz |
ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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≥ 1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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7.0 W/m-K |
GB-T32064
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q:Is there promotion price for big buyer?
A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Contact Person: Miss. Dana
Tel: 18153789196
