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High Voltage Insulation Pads Thermal Conductive Silicone Heatsink Sheet For Laptop GPU CPU

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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High Voltage Insulation Pads Thermal Conductive Silicone Heatsink Sheet For Laptop GPU CPU

High Voltage Insulation Pads Thermal Conductive Silicone Heatsink Sheet For Laptop GPU CPU
High Voltage Insulation Pads Thermal Conductive Silicone Heatsink Sheet For Laptop GPU CPU
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF7160Z thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Name: High Voltage Insulation Pads Thermal Conductive Silicone Heatsink Sheet For Laptop GPU CPU Thermal Conductivity: 7.0 W/m-K
Keyword: Silicone Heatsink Sheet Material: Silicone
Certification: UL Applications: CPU Cooling
Thickness: 4.0mmT
Highlight:

High Voltage Silicone Heatsink Sheet

,

Thermal Conductive Silicone Heatsink Sheet

,

Laptop GPU CPU Silicone Heatsink Sheet

High Voltage Insulation Pads Thermal Conductive Silicone Heatsink Sheet For Laptop GPU CPU

 

   The TIF7160Z is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

 

TIF700Z-Series-Datasheet(E)-REV01.pdf

 

 

High Voltage Insulation Pads Thermal Conductive Silicone Heatsink Sheet For Laptop GPU CPU 0

 

Features

 

> Good thermal conductive: 7.0 W/mK

> Thickness: 4.0mmT

> hardness:55 shore 00

> Colour: Grey

> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance

 

 

 

Applications

 

> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

 

 

Typical Properties of  TIF7160Z  Series
Color
Grey
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

 3.45 g/cc 

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
4.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

 55 Shore 00

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity
7.0W/mk
ASTMD5470
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 200℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

 4.5MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
5.2X1013
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

7.0 W/m-K

GB-T32064
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 

 

 

 

 

 

 

 

 

 

 

 

Company Profile

 

With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

High Voltage Insulation Pads Thermal Conductive Silicone Heatsink Sheet For Laptop GPU CPU 1

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)