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Product Details:
Payment & Shipping Terms:
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Volume Resistivity: | 1.0X10^12 Ohm-cm | Keyword: | Thermal Gap Pad |
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Dielectric Constant: | 4.6 MHz | Name: | 3.0mmT Soft And Compressible For Low Stress Applications Conductive Pads For CD-Rom |
Construction & Compostion: | Ceramic Filled Silicone Elastomer | Fire Rating: | 94 V0 |
Highlight: | 3.0mm thermal gap pad,CD Rom thermal gap pad,3.0mm silicone thermal pad |
3.0mmT Soft and Compressible for Low Stress Applications Conductive Pads for CD-Rom
The TIF1120-20-10UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling
TIF100-20-10UF-Datasheet-REV02.pdf
Features
> Good thermal conductive: 2.0 W/mK
>Thickness: 3.0mmT
>hardness:75 shore 00
>Colour: Gray
>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating
Applications
>Automotive electronics
>Set top boxes
>Audio and video components
>IT infrastructure
>GPS navigation and other portable devices
>CD-Rom, DVD-Rom cooling
Typical Properties of TIF1120-20-10UF Series
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Color
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gray |
Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
Construction &
Compostion |
Ceramic filled silicone elastomer
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
2.7 g/cc |
ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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Thickness |
3.0mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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75 Shore 00 |
ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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Outgasing (TML) |
0.35%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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***
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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4.6 MHz |
ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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2.0 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.
Our vast experience allows us to assist our customers best in thermal engineering field.
We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
FAQ:
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
Q: What is your terms of payment ?
A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.
Contact Person: Dana Dai
Tel: 18153789196