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Product Details:
Payment & Shipping Terms:
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| Dielectric Breakdown Voltage: | >5500 VAC | Keyword: | Thermal Gap Pad |
|---|---|---|---|
| Name: | 75 Shore 00 High Tack Surface Reduces Contact Resistance Thermal Pad For Notebook | Construction & Compostion: | Ceramic Filled Silicone Elastomer |
| Thickness: | 4.5mmT | Continuos Use Temp: | -40 To 160℃ |
| High Light: | small notebook thermal gap pad,4.5mm thickness thermal gap pad,4.5mm thickness silicone thermal pad |
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75 Shore 00 High Tack Surface Reduces Contact Resistance Thermal Pad for Notebook
The TIF1180-05UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF100-05UF Datasheet-REV02.pdf
Features
> Good thermal conductive: 1.5 W/mK
>Thickness: 4.5mmT
>hardness:75 shore 00
>Colour: Blue
>Outstanding thermal performance
>High tack surface reduces contact resistance
>RoHS compliant
Applications
>mainboard/mother board
>notebook
>power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
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Typical Properties of TIF1180-05UF Series
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Color
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Blue |
Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone elastomer
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
2.2 g/cc |
ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
4.5mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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75 Shore 00 |
ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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| Outgasing (TML) |
0.35%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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***
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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3.9 MHz |
ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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1.5 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.
Our vast experience allows us to assist our customers best in thermal engineering field.
We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
Q: What is your terms of payment ?
A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.
Contact Person: Miss. Dana
Tel: 18153789196
