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RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU

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RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU

RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU

Large Image :  RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF1160-30-05US
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Products Name: RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU Thickness: 4.0mmT
Outgasing (TML): 0.35% Thermal Conductivety: 3.0W/mK
Operating Temp: -40 To 160℃ Dielectric Breakdown Voltage: 94 V0
Volume Resistivity: 1.0X10¹² Ohm-cm
Highlight:

4.0 mmt thermal gap pad

,

motherboard thermal gap pad

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3.0 w mk thermally conductive gap filler

RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU

 

TIF1160-30-05US Series thermally conductive interface materials areapplied to fill the air gaps between the heating elements and the heatdissipation fins or the metal base.Their flexibility and elasticity make themsuited to coat very uneven surfaces. Heat can transmit to the metalhousing or dissipation plate from the heating elements or even the entirePCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

 

TIF100-30-05US-Series-Datasheet.pdf

 

RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU 0

 

Features

> Good thermal conductive: 3.0 W/mK 

> Thickness:4.0mmT

> Hardness:18 shore 00

UL recognized & RoHS Compliance

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness

 

 

Applications

RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

 

 

Typical Properties of TIF1160-30-05US Series
Color
blue
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.0g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
4.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
18 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 

 

 

 

 

 

 

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU 1

 

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)