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Thermal Gap Filler 1.9 G/Cm3 12±5 Shore 00 For Heat Pipe Thermal Solutions

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Thermal Gap Filler 1.9 G/Cm3 12±5 Shore 00 For Heat Pipe Thermal Solutions

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Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF1100-01ES

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 work days
Supply Ability:	100000pcs/day

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Detailed Product Description

Heat Capacity:	1 L/g-K	Thermal Conductivity:	1.5 W/m-K
Hardness:	12±5 Shore 00	Density:	1.9 G/cm3
Continuos Use Temp:	-40 To 160℃	Flame Rating:	94 V0
Highlight:	Thermal Gap Filler 1.9 G/Cm3 , Thermal Gap Filler 12±5 Shore 00 , Heat Pipe Thermal Solutions thermal filler

low cost and popular thermal gap filler,1.9 g/cm3,12±5 Shore 00 for Heat pipe thermal solutions

The TIF1100-01ES thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

Features

> Good thermal conductive: 1.5 W/mK

>Thickness:2.5mmT

>hardness:12±5 shore00

>Colour:drak gray

>Fiberglass reinforced for puncture, shear and tear resistance

>Moldability for complex parts

Applications

>Semiconductor automated test equipment (ATE)

>display card

>mainboard/mother board

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF1100-01ES Series
Color	drak gray	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone rubber	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	1.9 g/cm³	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	2.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	12±5 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgassing(TML)	0.30%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	2.9 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	1.5 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Tag:

Contact Person: Dana Dai

Tel: 18153789196

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Thermal Gap Filler 1.9 G/Cm3 12±5 Shore 00 For Heat Pipe Thermal Solutions

Thermal Gap Filler 1.9 G/Cm3 12±5 Shore 00 For Heat Pipe Thermal Solutions

Thermal Gap Filler 1.9 G/Cm3

Thermal Gap Filler 12±5 Shore 00

Heat Pipe Thermal Solutions thermal filler

thermal conductive pad,

thermal interface pad,

heatsink thermal pad