Send Message
Home ProductsThermal Gap Pad

Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules 

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules 

Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules 
Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules 
video play

Large Image :  Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules 

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF5200-40-11US
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Hardness: 20 Shore 00 Specific Gravity: 3.1 G/cc
Dielectric Breakdown Voltage: >5500 VAC Fire Rating: 94-V0
Construction & Compostion: Ceramic Filled Silicone Rubber Tensile Strength: 40 Psi
High Light:

Thermal Gap Filler 3.1 G/Cc

,

Thermal Gap Filler 4w/MK

,

40 Psi Thermal Gap Pad

China company supplied thermal gap filler 4w/MK Specific Gravity 3.1 g/cc for RDRAM memory modules
 

The TIF5200-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling


TIF500-40-11US Datasheet-REV02.pdf
 
Features:
>  Good thermal conductive: 4.0 W/mK 
>Thickness:5.0mmT
>hardnesses :20 (Shore 00)

>UL recognized

>Fiberglass reinforced for puncture, shear and tear resistance

>Easy release construction

>Electrically isolating

>High durability

 

Applications:

>RDRAM memory modules

>Micro heat pipe thermal solutions

>Automotive engine control units

>CD-Rom, DVD-Rom cooling

>LED Power Supply

>LED Controller

>LED Ceilinglamp

 
Typical Properties of TIF5200-40-11US Series
Color

gray

Visual Composite Thickness  hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

3.1 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Thickness

5.0mmT

***

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
20 (Shore 00) ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77 

Tensile Strength 

40 psi

ASTM D412

90mils / 2.286 mm

1.91 

100mils / 2.540 mm

2.05

Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

2.16   

120mils / 3.048 mm

2.29   

Dielectric Breakdown Voltage
>5500 VAC ASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
4.0 MHz ASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
6.0X1013
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05 

200mils / 5.080 mm

3.14

 
Thermal conductivity 
4.0 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

 

TIF™ series Individual die cut shapes can be supplied.

 
Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules  0

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

 

FAQ:

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)