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Product Details:
Payment & Shipping Terms:
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| Thickness: | 4mmT | Product Name: | Z-FOAM8160 |
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| Density: | 0.35±0.03 G/cm3 | Compressive Stress,25%: | 65±10kpa |
| Application: | Electronic Products | ||
| High Light: | silicone gasket material,high temp silicone gasket |
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Electronic products applied silicone foam materials 4mmT Z-FOAM8160 series sealing foam
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.
Our vast experience allows us to assist our customers best in thermal engineering field.
We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Z-Foam8160 Series is the Ziitek research and development of silicone foam materials used for high temperature and high pressure.
We have different hardness and thickness specifications can be the user's flexible choice. At the same time, we can choose to join the fiberglass to increase the stability of the product size and improve the tear strength.
Z-Foam800-10SC-Series-Silicone-Foam-Specifications...
Features
Thickness: 4mmT
Provides enhanced sealing performance
Good cushioning and high compression
Resistance to ultraviolet light,ozone
Compressed after using a good recovery
Application
Electronic products
Car Battery
Traffic Equipment
Communication & Electrical Equipment
Charging Pile
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Typical Properties of Z-Foam8160-10SC Series |
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Color |
Gray |
Visual |
Tensile strength |
≥0.3Mpa |
GB/T 528-2009 |
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Density |
0.35±0.03 g/cm3 |
ASTM D1056 |
Elongation |
≥90 |
GB/T 528-2009 |
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Compressive stress,25% |
65±10kpa |
ASTM D1056 |
Bibulous rate |
≤5.0% |
ASTM D570 |
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Compression permanent deformation |
≤5.0% |
ASTM D1056 |
Dielectric strength |
≥3.0KV/mm |
GB/T 1695-2005 |
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Standard Thicknesses:
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contractContact Person: Miss. Dana
Tel: 18153789196
