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Customized Self Adhesive High Heat Transfer Thermal Pad For Smartphones Laptops

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Customized Self Adhesive High Heat Transfer Thermal Pad For Smartphones Laptops

Customized Self Adhesive High Heat Transfer Thermal Pad For Smartphones Laptops

Large Image :  Customized Self Adhesive High Heat Transfer Thermal Pad For Smartphones Laptops

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-18-11E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Customized Self Adhesive High Heat Transfer Thermal Pad For Smartphones Laptops Keywords: Thermal Pad
Thermal Conductivity& Compostion: 1.8 W/m-K Size: Customized
Thickness: 1mmT Color: Gray
Hardness: 35 Shore 00 Application: Smartphones Laptops
Highlight:

self adhesive thermal gap filler pad

,

1mm high conductivity thermal pad

,

1.8W/mK high performance thermal pads

Customized Self Adhesive High Heat Transfer Thermal Pad For Smartphones Laptops

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Customized Self Adhesive High Heat Transfer Thermal Pad For Smartphones Laptops 0

The TIF100-18-11E is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


Features

 

> Available in varies thicknesses 1.8 W/mK
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance


Applications

 

> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of TIF100-18-11E Series
Property Value Test method
Color Gray ***
Construction &Compostion Ceramic filled silicone elastomer ***
Specific Gravity 2.3 g/cc ASTM D297
Hardness 35 Shore 00 ASTM 2240
Outgassing(TML) 0.55% ASTM D412
Continuos Use Temp -40 to 160℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 3.7MHz ASTM D150
Volume Resistivity 4.0X10¹³ Ohm-meter ASTM D257
Flame rating 94 V0 equivalent UL
Thermal conductivity 1.8W/m-K ASTM D5470

 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.


Standard Sheets Sizes:      
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 
 
Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
Customized Self Adhesive High Heat Transfer Thermal Pad For Smartphones Laptops 1

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)

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