logo
Home ProductsThermal Conductive Pad

Smart Phone Green 2.0W/MK Thermal Conductivity Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

Smart Phone Green 2.0W/MK Thermal Conductivity Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB

Smart Phone Green 2.0W/MK Thermal Conductivity Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB

Large Image :  Smart Phone Green 2.0W/MK Thermal Conductivity Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF140-20-18S
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Product Name: Smart Phone Green 2.0W/MK Thermal Conductivity Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB Color: Green
Thickness: 1.0 MmT Dielectric Breakdown Voltage: >5500 VAC
Thermal Conductivity: 2.0W/mK Construction & Compostion: Ceramic Filled Silicone
Keywords: Thermal Conductivity Pad Application: CPU/LED/PCB/GPU/SSD
Highlight:

thermally conductive pad

,

thermal conductive material

,

thermal conductive pad 2W

Smart Phone Green 2.0W/MK Thermal Conductivity Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

The TIF®140-20-18S use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

 

Features

 

> Good thermal conductivity: 2.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Easy release construction
> Electrically isolating
> High durability


Applications

 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card

 

Typical Properties of TIF®140-20-18S Series
Property Value Test method
Color Green ******
Construction &Compostion Ceramic filled silicone elastomer ******
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ASTM D374
Specific Gravity 2.65 g/cc ASTM D297
Hardness 45 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage > 5500 VAC ASTM D149
Dielectric Constant 4.7 MHz ASTM D150
Volume Resistivity 7.3 X1013 Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Outgassing(TML) 0.35% ASTM E595
Thermal conductivity 2.0 W/m-K ASTM D5470

 

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.

 
Smart Phone Green 2.0W/MK Thermal Conductivity Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)