Application In Electronic Parts High Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For AI Servers Thermal Management

Name: Application In Electronic Parts High Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For AI Servers Thermal Management
Brand: Dongguan Ziitek Electronical Material and Technology Co., Ltd
SKU: TIF140-30-15E
Price: 5.10 USD
Availability: InStock

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Application In Electronic Parts High Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For AI Servers Thermal Management

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Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF140-30-15E
Document:	TIF100-30-15E_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	Negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-7days
Payment Terms:	T/T
Supply Ability:	100000pcs/day

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Application In Electronic Parts High Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For AI Servers Thermal Management

Description

Product Name:	Application In Electronic Parts High Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For AI Servers Thermal Management	Density(g/cm³）:	3.0
Thermal Conductivity:	3 W/m-K	Hardness（ Shore 00）:	65/35
Dielectric Constant @1MHz:	7.5	Flame Rating:	UL94 V-0
Keywords:	AI Servers Thermal Management	Application:	AI Servers
Sample:	Free Sample
Highlight:	thermally conductive pad , thermal conductive material , 3w silicone pad

Application In Electronic Parts High Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For AI Servers Thermal Management

Product Overview

The TIF^®️140-30-15E Series is recommended for applications that require minimal pressure on components. The viscoelastic nature of the material provides excellent low-stress vibration dampening and shock absorption characteristics. Ziitek TIF^®️140-30-15 is an electrically isolating material, suitable for applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Key Features

Good thermal conductivity: 3.0W/mK
Moldability for complex parts
Soft and compressible for low stress applications
Naturally tacky, requiring no additional adhesive coating

Applications

LED lighting
Micro heat pipe
Electronic parts
Telecommunication hardware
Cooling components to chassis frame or other mating components
Home and small office network equipment
Handheld portable electronics
Plasma supply panels
Semiconductor automated test equipment (ATE)
Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Radios
Power electronics

Typical Properties of TIF^®100-30-15E Series

Property	Value	Test Method
Color	Purple	Visual
Construction	Ceramic filled silicone elastomer	-
Density (g/cm³)	3.0	ASTM D792
Thickness Range (inch/mm)	0.010~0.020 \| 0.030~0.200 0.25~0.50 \| 0.75~5.00	ASTM D374
Hardness (Shore 00)	65 \| 35	ASTM 2240
Recommended Operating Temperature	-40 to 200℃	-
Breakdown Voltage (V/mm)	≥5500	ASTM D149
Dielectric Constant @1MHz	7.5	ASTM D150
Volume Resistivity (Ohm-meter)	＞1.0×10¹²	ASTM D257
Flame rating	V-0	UL 94 (E331100)
Thermal conductivity (W/m-K)	3.0	ASTM D5470 ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm) - 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass), DC1 (Single-sided hardening)

Coating Options: NS1 (Non-adhesive treatment)

Adhesive Options: Single-sided/Double-sided adhesive

The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006 and is a high-tech enterprise specializing in the research, development, production, and sales of thermal interface materials. Our product range includes thermal joint filler, low melting point thermal interface materials, thermal insulator, thermal adhesive tape, thermal interface pad, thermal grease, thermal plastic, silicone rubber, and silicone rubber foam.

We adhere to the business philosophy of "survival by quality, development by quality" and continue to provide efficient, high-quality service to customers with our commitment to rigor, pragmatism, and innovation.

Factory Size: 8,000-10,000 square meters

Factory Location: No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online Service: 12 hours, fastest inquiry reply

Working Hours: 8:00am - 5:30pm, Monday to Saturday (UTC+8)

Language Support: Well-trained staff available to answer inquiries in English

Packaging: Standard export carton or customized with customer information

Samples: Free samples provided

After-Service: Even though our products undergo strict inspection, if you encounter any issues, please provide proof and we will help resolve the problem with a satisfactory solution.

Frequently Asked Questions

Do Thermal Silicone Pads age over time?

Like all polymer-based materials, thermal silicone pads can be affected by long-term exposure to temperature, humidity, and environmental conditions. High-quality thermal silicone pads are typically evaluated through tests such as high-temperature aging, thermal cycling, and humidity resistance to verify long-term stability.

What is the difference between a Thermal Silicone Pad and Thermal Grease?

A thermal silicone pad is a pre-formed solid material that is easy to install and provides controlled thickness. Thermal grease is a paste-like material that can fill very small surface irregularities and gaps, but its application thickness, pump-out behavior, and long-term stability need to be carefully considered.

What is the difference between a Thermal Silicone Pad and Thermal Gel?

A thermal pad is a pre-formed material, while thermal gel can be dispensed or coated to fill complex and irregular gaps. The choice between the two depends on the application structure, gap conditions, assembly method, and performance requirements.

Can Thermal Silicone Pads be used in AI servers?

Yes. Thermal silicone pads can be used between GPUs, CPUs, memory modules, power modules, and other heat-generating components and their corresponding cooling structures. They are commonly considered for thermal management in high-performance computing systems.

How do I determine the optimal thickness for a Thermal Silicone Pad?

First, measure the actual gap and its tolerance range. Then consider the material's compression characteristics, required assembly pressure, and target thermal resistance when selecting the thickness. Sample testing under actual application conditions is generally recommended to validate the final solution.

Overall Rating

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15.0W/mK High thermal conductive RoHS compliant UL recognized Manufacturer

Tag:

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Contact Details

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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Application In Electronic Parts High Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For AI Servers Thermal Management

Application In Electronic Parts High Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For AI Servers Thermal Management

Application In Electronic Parts High Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For AI Servers Thermal Management

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