logo
Home ProductsThermal Conductive Pad

New Products Silicone Thermal Conductive Gap Filler Pad 27 Shore 00 1.5W For LED Modules

china Dongguan Ziitek Electronic Materials & Technology Ltd. certification
china Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

New Products Silicone Thermal Conductive Gap Filler Pad 27 Shore 00 1.5W For LED Modules

New Products Silicone Thermal Conductive Gap Filler Pad 27 Shore 00 1.5W For LED Modules

Large Image :  New Products Silicone Thermal Conductive Gap Filler Pad 27 Shore 00 1.5W For LED Modules

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF140-19U
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Payment Terms: T/T
Supply Ability: 100000pcs/day
Detailed Product Description
Product Name: New Products Silicone Thermal Conductive Gap Filler Pad 27 Shore 00 1.5W For LED Modules Thermal Conductivity: 1.5 W/m-K
Construction: Ceramic Filled Silicone Elastomer Hardness: 27 Shore 00
Dielectric Constant@1MHz: 4.5 MHz Flame Rating: 94-V0
Keywords: Silicone Thermal Gap Pad Thickness: 1.0mmT
Appliation: Graphics Card Thermal Module, LED Modules
Highlight:

thermally conductive pad

,

thermal conductive material

,

27 Shore00 thermal silicone pad

New Products Silicone Thermal Conductive Gap Filler Pad 27 Shore 00 1.5W For LED Modules
 

Products description


The TIF®140-19U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
 
Features:
 
> Good thermal conductive: 1.5 W/mK 
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
 
Applications

 

> LED modules
> Micro heat pipe
> Automotive engine control units
> Telecommunication hardware
> Cooling components to chassis frame or other mating components
> Home and small office network equipment
> Handheld portable electronics
> Plasma supply panels
> Semiconductor automated test equipment (ATE)
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Radios
> Power electronics

 

Typical Properties of TIF®100-19U Series
Property Value Test method
Color Yellow Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.5 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 1.5 ASTM D5470
1.5 ISO22007
Fire rating V-0 UL 94 (E331100)

 

Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

New Products Silicone Thermal Conductive Gap Filler Pad 27 Shore 00 1.5W For LED Modules 0
Advantage


Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.


Our services


Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
 
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)