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Black Thermal Conductive Gap Filler Pad Ultra Soft Thermal Conductive Silicone Pad For Gpu Thermal Management Solutions

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Black Thermal Conductive Gap Filler Pad Ultra Soft Thermal Conductive Silicone Pad For Gpu Thermal Management Solutions

Black Thermal Conductive Gap Filler Pad Ultra Soft  Thermal Conductive Silicone Pad For Gpu Thermal Management Solutions

Large Image :  Black Thermal Conductive Gap Filler Pad Ultra Soft Thermal Conductive Silicone Pad For Gpu Thermal Management Solutions

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF140-01E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 10000pcs/day
Detailed Product Description
Product Name: Black Thermal Conductive Gap Filler Pad Ultra Soft Thermal Conductive Silicone Pad For Gpu Thermal Management Solutions Color: Black
Thermal Conductivity: 1.5 W/m-K Hardness: 35 Shore 00
Specific Gravity: 2.30 G/cc Dielectric Breakdown Voltage: >5500 VAC
Material: Ceramic Filled Silicone Elastomer Thickness: 1.0mmT
Keywords: Thermal Conductive Silicone Pad
Highlight:

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thermal gap filler pad 35shore00

Black Thermal Conductive Gap Filler Pad Ultra Soft Thermal Conductive Silicone Pad For Gpu Thermal Management Solutions

 

Products description

 

The TIF®140-01​E is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


Features:


> Good thermal conductive: 1.5 W/mK 
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> Available in varies thickness

> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance


Applications:


> IGBTs
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

> CPU
> Display card
> Mainboard/mother board
> Notebook

 

Typical Properties of TIF®140-01E Series
Color Black Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ASTM D374
Specific Gravity 2.3 g/cc ASTM D297
Hardness 35 Shore 00 ASTM 2240
Operating Temp -40 ~ 160℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant @1MHz 4.7 MHz ASTM D150
Volume Resistivity 1.0X1012 Ohm-cm ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 1.5 W/m-K ASTM D5470
 
Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16" (203mm x406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiate

Black Thermal Conductive Gap Filler Pad Ultra Soft  Thermal Conductive Silicone Pad For Gpu Thermal Management Solutions 0
Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)

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