Ziitek company exhibits thermal conductive materials the Embedded World 2020

Ziitek Electronical Material and Technology Ltd. attend the Embedded World 2020 fair during 25^th to 27^th Feb., 2020, at Hall 3, Stand 647.

We sincerely invite you come to visit and inquiry thermal conductive materials for your electronics.

Embedded World fair is founded in 2003 and is held annually. As one of the important annual events of embedded system industry and the largest embedded exhibition in the world, it divides into hardware, tools, applications and services four themes.

This fair covers industry 4.0, automation, industrial control, human-machine interface, internet of things, cloud computing, medical electronics, smart home, motor control, smart metering, industrial control, and so on many fields. For the semiconductor industries, industrial control, embedded interface card to the intelligent system, and the Internet of things solutions provides the world leading edge technology and trends in the field of display and communication platform.

We Ziitek company exhibited our main products of thermal conductive materials this time, such as silicone thermal pad, thermal conductive insulation pad, thermal gap filler putty, thermal tape， graphite sheet and so on.

Ziitek would keep providing you most suitable materials for any enviroment with your requirements.