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Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap

Good quality Thermal Conductive Pad for sales
Good quality Thermal Conductive Pad for sales
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Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap

China Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap supplier
Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap supplier Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap supplier

Large Image :  Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap

Product Details:

Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF200-02E

Payment & Shipping Terms:

Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
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Detailed Product Description
Color: Pink Thermal Conductivity: 1.0 W/m-K
Hardness: 35 Shore00 Specific Gravity: 1.75g/cc
Dielectric Constant: 5.5 MHz Continuos Use Temp: -50 To 200℃

 

Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap

 

 

The TIF™240 thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.


Features

 

> Thickness: 1mmT

> Materials:silicone thermal pads

> samples: provided
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> Available in varies size


Applications

 

> LED TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Heat Sinking Housing at LED-lit BLU in LCD

> Cooling components to the chassis of frame
> High speed mass storage drives

 

Typical Properties of TIF™240
Product Name TIF™200-U TIF™200-E TIF™200-S Visual Composite Thickness hermal Impedance
@10psi
(℃-in²/W)
Color Various Visual TIF™200-U

TIF™

200-E

TIF™200-S
Construction &
Compostion

Ceramic filled

silicone rubber

*** 12 mils 0.304mm 0.73 0.75 0.76
20 mils 0.508mm 0.95 0.97 0.98
Specific Gravity

1.75g/cc

ASTM D297 30 mils 0.762mm 1.17 1.18 1.20
40 mils 1.016mm 1.28 1.30 1.32
Heat Capacity

1 l/g-K

ASTM C351 50 mils 1.270mm 1.47 1.49 1.52
60 mils 1.524mm 1.68 1.70 1.73
Hardness 15 25 45 ASTM 2240 70 mils 1.778mm 1.86 1.88 1.91
Shore 00 80 mils 2.032mm 2.05 2.08 2.11
Tensile Strength

425 psi

ASTM D412 90 mils 2.286mm 2.21 2.24 2.28
100 mils 2.540mm 2.37 2.40 2.44
Continuos Use Temp -50 to 200℃

***

110 mils 2.794mm 2.49 2.53 2.57
120 mils 3.048mm 2.65 2.69 2.73
Dielectric Breakdown Voltage >5500 VAC ASTM D149 130 mils 3.302mm 2.82 2.86 2.91
140 mils 3.556mm 2.95 3.00 3.05
Dielectric Constant 5.5 MHz ASTM D150 150 mils 3.810mm 3.08 3.12 3.17
160 mils 4.064mm 3.20 3.25 3.30
Volume Resistivity 4.0X10"
Ohm-meter
ASTM D257 170 mils 4.318mm 3.34 3.39 3.44
180 mils 4.572mm 3.44 3.49 3.55
Fire rating 94 V0 equivalent UL 190 mils 4.826mm 3.52 3.57 3.63
200 mils 5.080mm 3.62 3.68 3.73
Thermal conductivity 1.0 W/m-K ASTM D5470 Visua l ASTMD751 ASTM D5470
 
 
Standard Thicknesses:           
0.0040" (1mm) 
Consult the factory alternate thickness.

Standard Sheets Sizes:         
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
 
 
Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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