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Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

Good quality Thermal Conductive Pad for sales
Good quality Thermal Conductive Pad for sales
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Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

China Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer supplier
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer supplier Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer supplier Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer supplier

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Product Details:

Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF7120

Payment & Shipping Terms:

Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
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Detailed Product Description
Thermal Conductivity& Compostion: 13 W/m-K Specific Gravity: 2.85 G/cc
Heat Capacity: 1 L /g-K Color: Gray
Continuos Use Temp: -50 To 200℃ Hardness: 45 Shore 00
Applications: Electronics Usage: Heat Transfer

 

Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

 

  The TIF7120 thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features:

 
>  Good thermal conductive:  13 W/mK 

>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness

 


Applications:


>  RDRAM memory modules 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps

>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF™7120
Color

gray

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
*** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity
2.85 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
45 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

55 psi

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage
>5500 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
4.5 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
5.6X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V-0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
13 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

 
Standard Thicknesses:        
  0.120" (3.05mm) 
Consult the factory alternate thickness.

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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