Thermally conductive gel design the matrix and filler reasonably

The key to improve the comprehensive performance of thermal conductive gel lies in the reasonable design of the properties of matrix and filler. The design of matrix can be carried out from the aspects of polymer type, relative molecular weight and distribution, cross-linking agent, chain extender, etc., and the modification of polymer from the aspects of changing the structure and arrangement of molecular chain. The design of the filler can be carried out from the aspect of improving the thermal conductivity, such as the surface functionalization of the traditional thermal conductive filler and the design of composite filler.

The existence and value of ZIITEK thermal conductive gel independently developed by ZIITEK is obvious. We immediately replaced ZIITEK thermal conductive gel for testing. The outcome of this time is very perfect, because ZIITEK thermal conductive gel is the thermal conductive gel loaded into the cylinder and formed into a sheet after going online. You can arbitrarily devastate it, compress it, the thermal conductive gel gasket can withstand, you let it fill the gap it will fill the gap, you let it instantly from 2mm to 0.5mm, Ziitek thermal conductive gel can meet one by one, the most important thing is that it does not resist, because ZIITEK thermal conductive gel gasket almost no stress, will not squeeze IC, It will not press the chip, so that the customer's products from thermal performance, structural design, electrical performance to complete product performance can meet the original design intention of the product manager.