In the era of AI, how can high thermal conductivity interface materials solve the cooling problem in data centers?

When AI large models and VR/AR these "power-consuming beasts" are running wildly, the CPUs and GPUs in data centers are undergoing a "high-temperature test" - they are both the core of computing power and the number one heat source. Once the heat dissipation fails to keep up, not only will the stability of the equipment be compromised, but the energy consumption and operation and maintenance costs will also keep rising rapidly. And the key to breaking through this heat dissipation dilemma lies in a detail that is often overlooked: the thermal interface material. So, where does the "heat anxiety" of data centers come from?
 

The computing power demand in the AI era is growing exponentially:
 

High-performance processors (such as CPUs/GPUs), as the "heart" of data centers, continuously release a large amount of heat when operating at full load. If this heat cannot be promptly dissipated, it may result in reduced performance or even system failure.
 

High-density storage devices:

After the data throughput increases, the heat generated by the storage chips also surges. Excessive heat will directly affect the data reading and writing speed as well as the lifespan of the device.

1. High Thermal Conductivity Interface Materials: Detailed Performance Analysis of Three "Thermal Enhancement Tools"

To handle the "heat burden" of AI computing power, ordinary thermal conductive materials are no longer sufficient. And nowadays, high thermal conductivity interface materials have already developed a dedicated "specialized thermal conductive material" lineup. As a manufacturer with 20 years of production experience, ZIITEK has a deep understanding of industry pain points and recommends the following products for how to solve the cooling problem in data centers:

High thermal conductivity silicone sheet: "Flexible thermal conductive sheet" suitable for complex scenarios
 

Core performance: The thermal conductivity is typically between 1.0 and 13 W/(m・K). It has excellent flexibility and insulation properties. The product's fire resistance rating reaches UL94 - V0. It has self-adhesive properties and does not require additional adhesives. It can be customized according to the thickness of the equipment gap.
 

Applicable scenarios: The highly precise bonding area between CPU/GPU coolers and the motherboard, the gap filling of storage device modules - It can simultaneously accommodate components of different heights, avoiding damage to the equipment caused by hard contact;
Advantages of AI scenarios: In the dense component layout of AI servers, it can flexibly fill irregular gaps, balancing heat dissipation efficiency and equipment protection.

2. High thermal conductivity phase change material: "Intelligent thermal conductive layer" that adapts to temperature
 

Core performance: At room temperature, it is in a solid state (facilitating transportation and installation). When the temperature reaches 50-60℃, it undergoes a phase change to a semi-liquid state, closely adhering to the surface of the chip and the heat sink.
 

Applicable scenario: Core heat dissipation surface of high-performance CPU/GPU - After phase change, it can fill nanoscale micro gaps, significantly reducing interface thermal resistance;
 

Advantages of AI scenarios: In large computing clusters, the power consumption of individual chips continues to rise. High thermal conductive gel can quickly transfer the concentrated heat away, preventing local overheating of the chips from causing a reduction in computing power.
Advantages of AI scenarios: During the training of large AI models, the chips will remain in a state of high load and high temperature for a long time. Phase change materials can maintain a close fit, preventing the thermal expansion and contraction of traditional solid materials from causing thermal conduction discontinuities.