Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials

Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials

The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. 

The TIC™808A  shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 

Features:

> 0.018℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required             
> No heat sink preheating required 

Applications:

> High Frequency Microprocessors

> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Typical Properties of TIC™808A Series
Product Name	TICTM808A				Testing standards
Color	Ashy				Visual
Composite Thickness	0.008" (0.203mm)
Thickness Tolerance	±0.0008" (±0.019mm)
Density	2.5g/cc				Helium   Pycnometer
Work Temperature	-25℃～125℃
phase transition  temperature	50℃~60℃
Setting temperature	70℃ for 5 minutes
Thermal conductivity	2.5 W/mK				ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa)	0.047℃-in²/W				ASTM D5470(modified)
	0.30℃-cm²/W

 

Standard Thicknesses:

0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                  
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)            
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive: 

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement: 

No reinforcement is necessary.

 

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products and so on, for various applications.