The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
Popular High durability Grey 1mm Thermal Conductive Silicone Pad TIF140-11E 2.95 g/cc good performance for LED The TIF140-11E is not only designed to take advantage of the gap heat transfer, to fill gaps, ... Read More
Heat Conductive 2w/Mk 1mmT Soft Silicone Adhesive Thermal Conductive Pad TIF140-20-02S UL 94V0 For Laptop Cooling Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing ... Read More
3W/mK high conductivity 1.5mmT thermal conductive gap pad TIF160-30-25S for IGBTs cooling The TIF160-30-25S thermally conductive interface materials are applied to fill the air gaps between the heating elements ... Read More
new developed 4w thermal conductive gap pad 20 shore00 silicone sheet 3.1 g/cc for mainboard/mother board The TIF580-40-11US use a special process, with silicone as the base material, adding thermal conductive ... Read More
pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible 7.5 MHz Dielectric Constant Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the ... Read More
Thermal Conductive Phase Change Materials Interface Pad Pink Low Resistance For LED Power Supply The TIC805P Series is low melting point thermal interface material. At 50, The TIC805P Series begins to soften ... Read More
45 psi Thermal Conductive Silicon Pad 2mmT 94 V0 for LED street light with good performance 3w TIF180-30-31S Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution ... Read More
Gap filler For LED street lamp 5 W/M-K grey thermal conductive pad TIF500-50-11US with 20 shore00 The TIF100-50-12E thermally conductive interface materials are applied to fill the air gaps between the heating ... Read More
China company supplied thermal gap filler 4w/MK Specific Gravity 3.1 g/cc for RDRAM memory modules The TIF5200-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows ... Read More
Pink Low Resistance Thermal phase chaging materials Interface Pad For Computer Serves 0.95 W/MK The TIC803P Series is low melting point thermal interface material. At 50, The TIC800P Series begins to soften and ... Read More
