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thermal conductive interface materials

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Phase Changing Materials (35)

Thermal Conductive Pad (153)

Thermal Gap Filler (186)

Thermal Conductive Grease (24)

Thermal Insulation Materials (43)

Thermal Graphite Sheet (50)

Thermal Adhesive Tape (44)

Thermal Conductive Glue (12)

Thermal Conductive Adhesive (10)

Thermal Conductive Plastic (20)

Sponge Foam Material (10)

PET Double Sided Tape (8)

Thermal Gap Pad (403)

Thermal Conductive Gel (22)

Silicone Foam Gasket (11)

Silicone Free Gap Filler Pad (14)

Shielding Absorbing Materials (19)

Thermal Conductivity Sharp Metal (2)

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thermal conductive interface materials

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UL 5.0 W Mk Thermal Gap Pad For Monitoring Power Box
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Broad range of hardnesses available thermal gap filler for Monitoring the Power Box The TIF1120-50-11US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low ... Read More

2023-08-18 11:16:07

4.5mmt Thermal Gap Pad Hardness 20 Shore 00 High Durability Silicone For Monitoring Power Box
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4.5mmT Hardness 20 shore 00 High durability silicone pads for Monitoring the Power Box The TIF1180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelast... Read More

2023-09-25 16:51:10

3.0w/Mk Thermal Gap Pad For Telecommunication Hardware
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3.0W/mk Light Gray Outstanding Thermal Performance Thermal Pad for Telecommunication Hardware The TIF120-30-02US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad ... Read More

2023-09-25 16:48:53

Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions
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Flexible Thermal Gap Filler Pad For Battery And Heat Sink Solutions TS-TIF100C 6530-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling ... Read More

2025-04-24 13:59:43

High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low Resistance -25℃ - 125℃
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High Frequency Microprocessors Thermal Interface Pad Low Resistance -25 - 125 The TIC800P Series is low melting point thermal interface material. At 50, The TIC800P Series begins to soften and flow, filling the ... Read More

2023-02-13 15:55:53

Rohs Compliant Silicone Thermal Gap Filler Sheets For High Speed Mass Storage Drives
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low cost RoHS compliant silicone sheets for High speed mass storage drives The TIF1100-40-11US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil ... Read More

2023-08-18 11:07:55

Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow
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Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow TIC800G series is low melting point thermal interface material. At 50, TIC800G series begins to soften and flow, ... Read More

2023-04-04 10:58:33

0.95 W/mK Low Thermal Resistance Pink Phase Changing Materials For IGBTs
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5.0 W/mK Low Thermal Resistance Pink Phase Changing Materials For IGBTs TIC808P series is low melting point thermal interface material. At 50, TIC808P series begins to soften and flow, filling the microscopic ... Read More

2023-02-13 15:59:52

Gray 2.5 W / MK Phase Changing Materials For Cache Chips , RoHs Approval
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Gray 2.5 W / MK Phase Changing Materials For Cache Chips , RoHs Approval The TIC810A is low melting point thermal interface material. At 50, The TIC800A Series begins to soften and flow, filling the microscopic ... Read More

2023-02-13 16:01:56

Cache Chips Gray 2.5 W/MK No Heat Sink Preheating Required Phase Changing Materials
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Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials The TIC808A is low melting point thermal interface material. At 50, The TIC808A Series begins to soften and flow, filling the ... Read More

2023-02-13 16:05:24

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