The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
No Need Preheating Pink Thermal Phase Change Interface Material For Notebook The TIC808P Series is low melting point thermal interface material. At 50, The TIC808P Series begins to soften and flow, filling the ... Read More
Pink Low Resistance Thermal phase chaging materials Interface Pad For Computer Serves 0.95 W/MK The TIC803P Series is low melting point thermal interface material. At 50, The TIC800P Series begins to soften and ... Read More
Gray Thermal Conductive Grease 2.5W / mK Non Toxic Safe with Metal Oxide Filled Silicone Oil The TIG780-25 products are the high-efficiency heat dissipation ones for the fillings between the electronic ... Read More
1.8W/mK White Thermal Conductive Grease for LED lighting Never Dry Non-toxic and environmentally safe The TIG780-18 products are the high-efficiency heat dissipation ones for the fillings between the electronic ... Read More
Gray Thermal Conductive Grease 2.5w Non-Toxic Safe For Cpu Heat Dissipation TIG780-25 Series Datasheet-(E)-REV01.pdf The TIG780-25 products are the high-efficiency heat dissipation ones for the fillings between ... Read More
Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK -49 - 392 The TIG780-20 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the ... Read More
pink 3.0W/mK CPU Heatsink Cutting Thermal Conductive Foam Ultrasoft Compressible 7.5 MHz Dielectric Constant Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the ... Read More
China Factory 2.5W Thermally Conductive Grease The TIG780-25 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the heat dissipation fins. They serve ... Read More
High cost-effective thermal conductive gap pad 205 Shore 00,3.0 W/m-K for mainboard/mother board The TIF1160-30-11US is an extremely soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. It is ... Read More
2.5W / mK CPU Heatsink 25 Shore 00 Thermally Conductive pad for Electronic Components -50 to 200 Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal ... Read More