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2.0W/MK Ceramic Filled Silicone Pink Thermal Conductive Pad Operating Temp -50 To 200℃ Thermal Gap Filler Pad

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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2.0W/MK Ceramic Filled Silicone Pink Thermal Conductive Pad Operating Temp -50 To 200℃ Thermal Gap Filler Pad

2.0W/MK Ceramic Filled Silicone Pink Thermal Conductive Pad Operating Temp -50 To 200℃ Thermal Gap Filler Pad

Large Image :  2.0W/MK Ceramic Filled Silicone Pink Thermal Conductive Pad Operating Temp -50 To 200℃ Thermal Gap Filler Pad

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-20-50U
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: 2.0W/MK Ceramic Filled Silicone Pink Thermal Conductive Pad Operating Temp -50 To 200℃ Thermal Gap Filler Pad Color: Pink
Specific Gravity: 2.6 G/cc Dielectric Breakdown Voltage: >55000 VAC
Dielectric Constant@ 1MHz: 4.9 MHz Construction: Ceramic Filled Silicone Elastomer
Operating: -40 To 160℃ Keywords: Thermal Gap Filler Pad
Thermak Conductivity: 2.0W/mK
Highlight:

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Rubber pink Thermal Conductive PAD

2.0W/MK Ceramic Filled Silicone Pink Thermal Conductive Pad Operating Temp -50 To 200℃ Thermal Gap Filler Pad

 

Products description

The TIF®100-20-50U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features:


>  Good thermal conductive: 2.0 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF®100-20-50U Series
Color Pink Visual
Construction &Compostion Ceramic filled silicone elastomer *****
Specific Gravity 2.6 g/cc ASTM D297
Hardness 27 Shore 00 ASTM 2240
Thickness range 0.020"(0.5mm)~0.200“(5.0mm) ASTM D374
Continuos Use Temp -40 to 160℃ *****
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant @1MHz 4.9 MHz ASTM D150
Volume Resistivity 6.4X1013Ohm-cm ASTM D257
Fire rating 94 -V0 UL E331100
Thermal conductivity 2.0 W/m-K ASTM D5470
 
 
Product specification

Standard Sheets Sizes: 8" x 16"(203mm x 406mm) 
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.

Peressure Sensitive Adhesive:            
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
TIF™ series sheets type can add with fiberglass reinforced.
2.0W/MK Ceramic Filled Silicone Pink Thermal Conductive Pad Operating Temp -50 To 200℃ Thermal Gap Filler Pad 0
Company profile
 
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

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