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Product Details:
Payment & Shipping Terms:
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| Product Name: | TIG780-38 | Color: | Gray |
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| Evaporation: | 0.15% / 200℃@24hrs | Specific Gravity: | 2.5 G/cm3 |
| Thermal Conductivity: | 3.8 W/mK | ||
| High Light: | cpu thermal paste,heat sink grease,High Thermal Conductive Grease |
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High Thermal Conductivity Heat Dissipation Thermal Paste for CPU Heatsink Cooling
The TIG™780-38 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the heat dissipation fins. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance. Consequently, the heat dissipation efficiency is far superior to that offered by others.
TIG780-38 Series Datasheet-(E)-REV01.pdf
Applications lnclude
| Semiconductor cases and heat sinks |
| Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices |
| CPUs and GPUs |
| Automatic dispensing and screen-printing |
| Mobile, desktop |
| Engine and transmission control modules |
| Memory modules |
| Power conversion equipment |
| Power supplies and UPS |
| Power semiconductors |
| Custom ASICS Chips |
| Integrated Gate Bipolar Transistors (IGBT) |
| Between any heat generating semiconductor and heat sink |
| Custom power modules |
| Telecommunications and automotive electronics |
Features:
| Low thermal resistance |
| One component paste like interface material, never dry |
| Thermal compound formulated to maximize the heat transfer |
| Outstanding electrical insulation properties and will not harden on long exposure to elevated temperatures |
| Non-toxic and environmentally safe |
| Silicone-based materials conduct heat between a hot component and a heat sink or enclosure |
| Fills interface variable tolerances in electronics assemblies and heat sink applications |
| Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration |
| Thermally stable and require virtually no compressive force to deform under typical assembly pressures |
| Supports high power applications requiring material with minimum bond line thickness and high conductivity |
| Ideal for rework and field repair situations |
| Low bleed and evaporation |
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Typical Properties of TIG™780-38 Series |
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| ProductName | TIG™780-38 | Test Method |
| Color | Gray | Visual |
| Construction & Compostion |
Metal oxide filled silicone oil | |
| Viscosity | 1800K cps @.25℃ | Brookfield RVF,#7 |
| Specific Gravity | 2.5 g/cm3 | |
| Continuous Use Temp | -49℉ to 392℉ / -45℃ to 200℃ | ***** |
| Evaporation |
0.15% / 200℃@24hrs
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| Thermal Conductivity | 3.8 W/mK | ASTM D5470 |
| Thermal lmpedance | 0.04℃-in²/W @ 50 psi(344 KPa) | ASTM D5469 |
Package:
TIG™780 Series is available in 1kg(pint container),3kg(quart container),and 10kg(gallon container)or custom packaged in syringes for automated applications.
Contact Person: Miss. Dana
Tel: 18153789196
