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Green Compressible Thermal Conductive Pad With Ceramic Filled Silicone Rubber 1.5W/MK For AI Processors Cooling

china Dongguan Ziitek Electronic Materials & Technology Ltd. certification
china Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Green Compressible Thermal Conductive Pad With Ceramic Filled Silicone Rubber 1.5W/MK For AI Processors Cooling

Green Compressible Thermal Conductive Pad With Ceramic Filled Silicone Rubber 1.5W/MK For AI Processors Cooling

Large Image :  Green Compressible Thermal Conductive Pad With Ceramic Filled Silicone Rubber 1.5W/MK For AI Processors Cooling

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF140-15-07S
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Prodcuts Name: Green Compressible Thermal Conductive Pad With Ceramic Filled Silicone Rubber 1.5W/MK For AI Processors Cooling Continuos Use Temp: -50 To 200℃
Dielectric Breakdown Voltage: >10000 VAC Dielectric Constant: 5.5 MHz
Color: Green Specific Gravity: 2.10 G/cc
Keywords: Thermal Conductive Pad
Highlight:

thermally conductive pad

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Compressible Thermal Conductive Pad

Green Compressible Thermal Conductive Pad With Ceramic Filled Silicone Rubber 1.5W/MK For AI Processors Cooling

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

The TIF140-15-07S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

Features:


>  Good thermal conductive: 1.5 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF140-15-07S Series
Color

Green

Visual
Construction & Compostion
Ceramic filled silicone rubber
******
Specific Gravity

2.10 g/cc

ASTM D297
Heat Capacity

1 l/g-K

ASTM C351
Hardness
27/35/45/60 (Shore 00) ASTM 2240
Tensile Strength 

40 psi

ASTM D412

Continuos Use Temp

-50 to 200℃

******

Dielectric Breakdown Voltage
>1500~>5500 VAC ASTM D149
Dielectric Constant
5.5 MHz ASTM D150
Volume Resistivity
4.0X10" Ohm-meter ASTM D257
Fire rating
94 V0

equivalent UL

Thermal conductivity
1.5 W/m-K ASTM D5470

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
Green Compressible Thermal Conductive Pad With Ceramic Filled Silicone Rubber 1.5W/MK For AI Processors Cooling 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)