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Dark Gray Soft 8.0W/MK Silicone Thermal Conductive Pad For Computer CPU GPU Heat Dissipation

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Dark Gray Soft 8.0W/MK Silicone Thermal Conductive Pad For Computer CPU GPU Heat Dissipation

Dark Gray Soft 8.0W/MK Silicone Thermal Conductive Pad For Computer CPU GPU Heat Dissipation

Large Image :  Dark Gray Soft 8.0W/MK Silicone Thermal Conductive Pad For Computer CPU GPU Heat Dissipation

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-H80-11E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day
Detailed Product Description
Prodcuts Name: Dark Gray Soft 8.0W/MK Silicone Thermal Conductive Pad For Computer CPU GPU Heat Dissipation Recommended Operating Temperature (°C): -40 To 200℃
Density: 3.5g/cm³ Breakdown Voltage(V/mm): ≥5500VAC
Dielectric Constant @ 1MHz: 5.5 MHz Construction & Compostion: Ceramic Filled Silicone Elastomer
Keywords: Thermal Conductive Pad Application: Computer CPU GPU Heat Dissipation
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1.5W/mK Thermal Conductive Pad

Dark Gray Soft 8.0W/MK Silicone Thermal Conductive Pad For Computer CPU GPU Heat Dissipation

 

Company Profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

The TIF®100-H80-11E Series is a high-end compressible thermal pad designed to meet top-level cooling requirements while maintaining excellent assembly workmanship.Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by ultra-high heat flux densities, while also providing good mechanical strength and compressibility,making it easy to process and install. It offers a reliable interface material solution with both outstanding thermal performance and high reliability for high-power-density electronic devices.


Features:


> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available


Applications:

 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

 
Typical Properties of TIF®100-H80-11E Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.5 ASTM D792
Thickness Range(inch/mm) 0.020~0.030 0.040~0.200 ASTM D374
(0.50~0.75) (1.0~5.0)
Hardness 60 Shore 00 35 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant@ 1HMz 5.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 8.0 W/m-K ASTM D5470
8.0 W/m-K ISO22007
 
Product Specifications

Standard Thickness:0.020" (0.50 mm)~0.200" (5.00 mm)
with increments of 0.010" (0.25 mm)
Standard Size:16"X16" (406 mmX406 mm)

Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Dark Gray Soft 8.0W/MK Silicone Thermal Conductive Pad For Computer CPU GPU Heat Dissipation 0
Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)