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Product Details:
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| Keywords: | Silicon Gap Filler | Thermal Conductivity: | 2.6 W/m-K |
|---|---|---|---|
| Hardness: | 18 Shore 00 | Specific Gravity: | 2.95 G/cc |
| Dielectric Constant: | 4.3 MHz | Flame Rating: | 94-V0 |
| Highlight: | thermally conductive pad,thermal conductive material,Violet Thermal Conductive Pad |
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Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad
The TIF™500US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 2.6 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
| Typical Properties of TIF™500US Series | ||
| Color | Violet | Visual |
| Construction & Compostion | Ceramic filled silicone rubber | ****** |
| Thickness range | 0.020"(0.50mm)~0.200"(5.0mm) | ASTM D374 |
| Specific Gravity | 2.95 g/cc | ASTM D297 |
| Outgassing(TML) | 0.55% | ASTM C351 |
| Hardness | 18 Shore 00 | ASTM 2240 |
| Operating Temp | -40 to 160℃ | ****** |
| Dielectric Breakdown Voltage(T-1.0mm) | >5500 VAC | ASTM D149 |
| Dielectric Constant@1MHZ | 4.3 | ASTM D150 |
| Volume Resistivity | 4.2X10¹³" Ohm-meter | ASTM D257 |
| Flame rating | 94-V0 | equivalent UL |
| Thermal conductivity | 2.6 W/m-K | ASTM D5470 |
Product Specification
Product Thicknesses: 0.020-inch to 0.200-inch(0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confrming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge
Contact Person: Miss. Dana
Tel: 18153789196
