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Product Details:
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| Name: | Good Elasticity 2.0W/MK Two Component Silicone Potting Compound For New Energy Vehicle Electronics | Keywords: | Silicone Potting Compound |
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| Thermal Conductivity: | 2.0W/m-K | Density: | 2.9 G/cm³ |
| Application: | New Energy Vehicle Electronics | Hardness(Shore 00): | 20 |
| Packing: | 1kg/can | Components: | Two Component |
| Highlight: | two component silicone potting compound,2.0W/mK thermal conductive glue,potting compound for EV electronics |
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TIG®680-20AB is a two-component addition-curing silicone material. When the A and B components are mixed in a specific ratio, it cures at room temperature or under heating conditions. After curing, it forms a dense elastomer with good thermal conductivity, electrical insulation, resistance to high and low temperatures, and anti-aging properties. The curing process produces no by-products and features low shrinkage, enabling tight adhesion to various substrates, effective filling of gaps in electronic components, and realization of thermal conduction, insulation, waterproofing, shock absorption, flame retardancy, and mechanical protection for electronic assemblies.
| Property | Value | Test Method |
|---|---|---|
| Uncured Material Properties | ||
| Composition | Ceramic-filled silicone | — |
| Color / Part A | White | Visual |
| Color / Part B | Gray | Visual |
| Part A Viscosity (mPa·s) | 8200 | GB/T D2196 |
| Part B Viscosity (mPa·s) | 9600 | GB/T D2196 |
| Mix Ratio | 1:1 | — |
| Cure Schedule | ||
| Cure @ 25°C (min) | 20–30 | ZKTM G010 |
| Cure @ 70°C (min) | 10 | ZKTM G010 |
| Cured Material Properties | ||
| Color | Gray | Visual |
| Hardness (Shore A) | 20 | ASTM D2240 |
| Density (g/cm³) | 2.9 | ASTM D792 |
| Recommended Operating Temperature (°C) | -45 to 200 | ZKTM J025 |
| Flame Rating | V-0 | UL 94 |
| Thermal Conductivity (W/m·K) | 2.0 | ASTM D5470 |
| Breakdown Strength (V/mm) | ≥10000 | ASTM D149 |
| Dielectric Constant @ 1MHz | 6.5 | ASTM D150 |
| Volume Resistivity (Ohm·cm) | >1.0×10¹² | ASTM D257 |
Ziitek was founded in 2006 as a high-tech enterprise specializing in the research and development, manufacturing, and solution development of thermal conductive, heating, sealing, and EMI materials.
Ziitek gathers professional R&D engineers and implements a joint development model, deeply participating in the early design of customer products. We empower customers with technological innovation and are committed to becoming a trusted material strategic partner for global customers.
A: We are a manufacturer based in China.
A: Generally 3–7 working days if the goods are in stock, or 7–10 working days if the goods are not in stock, depending on quantity.
A: Yes, we can offer samples free of charge.
A: TIM (Thermal Interface Material) refers to a class of materials used to fill microscopic air gaps between a heat source and a heat sink. TIMs help reduce interface thermal resistance and improve heat transfer from the heat source to the cooling structure. Common TIMs include thermal pads, thermal gels, thermal greases, phase change materials (PCMs), and liquid metal.
A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m·K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.
A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.
Contact Person: Dana Dai
Tel: +86 18153789196