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Good Elasticity 2.0W/MK Two Component Silicone Potting Compound For New Energy Vehicle Electronics

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China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Good Elasticity 2.0W/MK Two Component Silicone Potting Compound For New Energy Vehicle Electronics

Good Elasticity 2.0W/MK Two Component Silicone Potting Compound For New Energy Vehicle Electronics
Good Elasticity 2.0W/MK Two Component Silicone Potting Compound For New Energy Vehicle Electronics Good Elasticity 2.0W/MK Two Component Silicone Potting Compound For New Energy Vehicle Electronics

Large Image :  Good Elasticity 2.0W/MK Two Component Silicone Potting Compound For New Energy Vehicle Electronics

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIG680-20AB
Document: TIG680-20AB_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1KG/PC
Price: Negotiation
Packaging Details: 1kg/can
Delivery Time: 3-7 work days
Payment Terms: T/T
Supply Ability: 100KG

Good Elasticity 2.0W/MK Two Component Silicone Potting Compound For New Energy Vehicle Electronics

Description
Name: Good Elasticity 2.0W/MK Two Component Silicone Potting Compound For New Energy Vehicle Electronics Keywords: Silicone Potting Compound
Thermal Conductivity: 2.0W/m-K Density: 2.9 G/cm³
Application: New Energy Vehicle Electronics Hardness(Shore 00): 20
Packing: 1kg/can Components: Two Component
Highlight:

two component silicone potting compound

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2.0W/mK thermal conductive glue

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potting compound for EV electronics

TIG®680-20AB — Good Elasticity 2.0W/mK Two Component Silicone Potting Compound for New Energy Vehicle Electronics

TIG®680-20AB is a two-component addition-curing silicone material. When the A and B components are mixed in a specific ratio, it cures at room temperature or under heating conditions. After curing, it forms a dense elastomer with good thermal conductivity, electrical insulation, resistance to high and low temperatures, and anti-aging properties. The curing process produces no by-products and features low shrinkage, enabling tight adhesion to various substrates, effective filling of gaps in electronic components, and realization of thermal conduction, insulation, waterproofing, shock absorption, flame retardancy, and mechanical protection for electronic assemblies.

Key Features
  • Good thermal conductivity
  • Good insulation performance
  • Good elasticity
  • Lower shrinkage
  • Low viscosity, easy gas emissions
  • Good solvent resistance and waterproof performance
  • Longer working hours
  • Excellent high and low temperature resistance
  • No odor release during the curing process
Applications
  • New energy vehicle electronics
  • Industrial electronics and power equipment
  • Consumer electronics
  • Medical electronics
  • Aerospace electronic components
  • Rail transit electronic equipment
  • Marine detection equipment
Typical Properties of TIG®680-20AB
Property Value Test Method
Uncured Material Properties
Composition Ceramic-filled silicone —
Color / Part A White Visual
Color / Part B Gray Visual
Part A Viscosity (mPa·s) 8200 GB/T D2196
Part B Viscosity (mPa·s) 9600 GB/T D2196
Mix Ratio 1:1 —
Cure Schedule
Cure @ 25°C (min) 20–30 ZKTM G010
Cure @ 70°C (min) 10 ZKTM G010
Cured Material Properties
Color Gray Visual
Hardness (Shore A) 20 ASTM D2240
Density (g/cm³) 2.9 ASTM D792
Recommended Operating Temperature (°C) -45 to 200 ZKTM J025
Flame Rating V-0 UL 94
Thermal Conductivity (W/m·K) 2.0 ASTM D5470
Breakdown Strength (V/mm) ≥10000 ASTM D149
Dielectric Constant @ 1MHz 6.5 ASTM D150
Volume Resistivity (Ohm·cm) >1.0×10¹² ASTM D257
Packing Details
  • 1 KG A/B for each tank
  • 5 KG A/B each
  • 10 KG A/B each
TIG 680-20AB two component silicone potting compound packaging and product reference image
Company Profile

Ziitek was founded in 2006 as a high-tech enterprise specializing in the research and development, manufacturing, and solution development of thermal conductive, heating, sealing, and EMI materials.

  • Production Capacity Layout: Headquartered in Dongguan, Guangdong Province, with production bases in Kunshan (Jiangsu Province), Taiwan, and Vietnam. This global layout ensures rapid delivery.
  • Application Fields: New energy vehicles, energy storage, high-performance chips, laptops, security, AI automation, 5G communication, and aerospace.
  • Core Products: TIF thermal conductive pads series, Z-Paster non-silicon thermal conductive pads series, TIG thermal paste, TIC phase change thermal material, TIS thermal insulating material, TIA thermal double-sided adhesive, TIR high thermal conductivity conductive material, TIF900 series EMI materials, K-heat heating products (PI heating film, silicone heating sheet, PTC heater), Z-foam foaming silicone sealing parts, and TCP thermal engineering plastics.
  • Quality Certification: IATF16949, ISO9001, ISO14001, QC080000; products comply with RoHS, REACH, and UL standards.

Ziitek gathers professional R&D engineers and implements a joint development model, deeply participating in the early design of customer products. We empower customers with technological innovation and are committed to becoming a trusted material strategic partner for global customers.

Frequently Asked Questions
Q: Are you a trading company or a manufacturer?

A: We are a manufacturer based in China.

Q: How long is your delivery time?

A: Generally 3–7 working days if the goods are in stock, or 7–10 working days if the goods are not in stock, depending on quantity.

Q: Do you provide samples? Are they free or at extra cost?

A: Yes, we can offer samples free of charge.

Q: What is a Thermal Interface Material (TIM)?

A: TIM (Thermal Interface Material) refers to a class of materials used to fill microscopic air gaps between a heat source and a heat sink. TIMs help reduce interface thermal resistance and improve heat transfer from the heat source to the cooling structure. Common TIMs include thermal pads, thermal gels, thermal greases, phase change materials (PCMs), and liquid metal.

Q: What is Thermal Conductivity?

A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m·K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.

Q: What is Thermal Resistance?

A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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