White Thermal Conductive Gel Silicone Based Soft High Thermal Conductivity Gap Filler
TIF®040-06 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.
Features
- High thermal conductivity
- Soft, requires almost no pressure against components
- Low thermal impedance
- Easily adaptable for automated dispensing system operations
- Proven long-term reliability
Applications
- Heat-sink & frame
- LED backlight module, LED lighting
- High speed hardware driver
- Micro heat pipe
- Vehicle engine controller
- Telecom industry
- Semiconductor automatic laboratory equipment
Typical Properties of TIF®040-06
| Property |
Value |
Test Method |
| Color |
White |
Visual |
| Composition |
Ceramic filled silicon material |
ZKTM J024 |
| Flow Rate (g/min) |
40 |
ZKTM B014 (30cc syringe/2.5mm orifice/90 psi) |
| Density (g/cm³) |
3.2 |
ASTM D792 |
| Thermal conductivity (W/m*K) |
4.0 |
ASTM D5470 |
| Thermal Impedance (℃.in²w) @10psi |
0.080 |
ASTM D5470 |
| Thermal Impedance (℃*in²w) @50psi |
0.070 |
ASTM D5470 |
| Recommended Operating Temp (℃) |
-40 ~200 |
ZKTM J025 |
| Breakdown Strength (V/mm) |
≥8000 |
ASTM D149 |
| Bond Line Thickness (mm) |
0.15 |
ZKTM B047 |
| Oil Separation (%) @150°C,24 hrs |
＜0.03 |
HG/T 2502 |
| Volatility Loss (%) @150°C,24 hrs |
＜0.2 |
HG/T 2502 |
| Flame Rating |
V-0 |
UL 94 |
Product Specifications
30 cc/pcs, 50 cc/pcs, 300 cc/pcs, or custom packaging for automated applications.
For more information about thermal conductive materials, please contact our company.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive interface pads and thermal grease, Thermal Conductive plastic, Silicone Rubber, Silicone Foams, Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications
- ISO9001:2015
- ISO14001: 2004 IATF16949:2016
- IECQ QC 080000:2017
- UL
Frequently Asked Questions
Q: Are you trading company or manufacturer?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock, or it is 7-10 work days if the goods are not in stock, according to quantity.
Q: Do you provide samples? Is it free or extra cost?
A: Yes, we could offer samples free of charge.
Q: What is Thermal Gel?
A: Thermal gel is a TIM (Thermal Interface Material) with good flowability and gap-filling capability. It can be applied through dispensing, coating, or other application methods to fill gaps between heat sources and cooling structures.
Q: What is the main advantage of Thermal Gel?
A: The main advantage of thermal gel is its ability to adapt to complex structures and irregular gaps. It is particularly suitable for applications where multiple components with different heights need to be thermally managed simultaneously.
Q: What size gap is Thermal Gel suitable for?
A: The applicable gap range varies depending on the specific thermal gel. It should be determined based on the product's flowability, curing characteristics, and assembly structure.
Q: Will Thermal Gel flow or leak?
A: Different thermal gels have different rheological properties. During engineering design, factors such as high-temperature sag, flow behavior, and long-term stability should be evaluated to ensure reliable performance.
Q: Does Thermal Gel need to be cured?
A: It depends on the product type. Some thermal gels are non-curing, while others are designed to cure after application. The appropriate type should be selected according to the customer's production process and operating environment.
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