logo
Request A Quote |
Home ProductsThermal Gap Filler

Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components

All Products

Phase Changing Materials

(41)

Thermal Conductive Pad

(238)

Thermal Gap Filler

(243)

Thermal Conductive Grease

(28)

Thermal Insulation Materials

(47)

Thermal Graphite Sheet

(54)

Thermal Adhesive Tape

(44)

Thermal Conductive Glue

(12)

Thermal Conductive Adhesive

(13)

Thermal Conductive Plastic

(20)

Sponge Foam Material

(10)

PET Double Sided Tape

(8)

Thermal Gap Pad

(403)

Thermal Conductive Gel

(25)

Silicone Foam Gasket

(13)

Silicone Free Gap Filler Pad

(15)

Shielding Absorbing Materials

(19)

Thermal Conductivity Sharp Metal

(0)
Best Products
thermally conductive filler

thermally conductive filler

High Temperature Thermal Gap Filler

High Temperature Thermal Gap Filler

Conductive Thermal gap filler For Power Electronics Applications 1.5 W/M-K

Conductive Thermal gap filler For Power Electronics Applications 1.5 W/M-K

Certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components

Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components
Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components
Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components

Large Image :  Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-50-11F
Document: TIF100-15-01F_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day
Contact Now

Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components

Description
Thermal Conductivity: 1.5 W/m-K Construction: Ceramic Filled Silicone Elastomer
Model: TIF100-15-01F Color: Black
Product Name: Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components Application: Providing Heat Transfer For Electronic Components
Thickness: Available In Varies Thicknes Density: 2.3 G/cm³
Keywords: Thermal Gap Filler

Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components


Company Profile 


Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.


Products description 


The TIF®100-15-01F  Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation,insulation, and mechanical stability.


Features: 


>  Good thermal conductive: 1.5W/mK 
>  Soft and compressible for low stress applications
>  Naturally tacky needing no further adhesive coating
>  Available in varies thickness


Applications: 


>  Mainboard/mother board
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Automotive electronics
>  New energy vehicle
>  Motherboard chip
>  Radiator
>  AI Processors AI Servers

>  Cooling components to the chassis of frame
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD


Typical Properties of TIF®100-15-01F Series
Property Value Test method
Color Black Visual
Construction Ceramic filled silicone elastomer ******
Density(g/cm³) 2.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 60 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.5 W/m-K ASTM D5470
1.5 W/m-K ISO22007

Products specification 


Standard Thickness: 0.010"(0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size:16"×16" (406 mm×406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.


Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components 0

Packaging Details & Lead time 


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Independent R&D team 


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete  teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ: 


Q: How to find a right thermal conductivity for my applications 

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.  


Q: Do you accept custom orders ?  

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information . 


Q: How much are the pads? 

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price. 

Tag:

thermally conductive filler,

thermal conductivity silicone,

high temperature phase change materials

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

About

Thermal Gap Filler

Ultra Soft Thermal Gap Filler TIF4120 For Telecommunication Hardware

Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer

Grey Color Thermal Gap Filler Pads TIF8120 For Wireless Routers Applicated

Thermal Graphite Sheet

TIR300CU Copper Composite Carbon Nano Coating thermal graphite sheet

Black Natural Thermal Graphite Sheet 10.0W/m-K for Power conversion equipment

TIRTM380-CU-T2 high conductivity 320W CU coating Thermal Graphite Sheet 85 ShoreA 0.080mmT for Plasma supply panels

LEAVE MESSAGE

Privacy Policy | China Good Quality Phase Changing Materials Supplier. © 2015 - 2026 Dongguan Ziitek Electronic Materials & Technology Ltd.. All Rights Reserved.