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Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics
Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Large Image :  Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-50-11S
Document: TIF100-50-11S_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day

Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics

Description
Products Name: Wholesale 5.0W Silicone Thermal Pad Thermal Gap Filler For Automotive Electronics Thermal Conductivity& Compostion: 5.0 W/m-K
Specific Gravity: 3.15g/cm³ Construction: Ceramic Filled Silicone Elastomer
Color: Gray Continuos Use Temp: -40 To 200℃
Hardness: 65/45 Shore 00 Keywords: Thermal Gap Filler
Application: Automotive Electronics

Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics


Products description


The TIF®100-60-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:


> Good thermal conductive: 6.0 W/mK

> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications:


>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Memory Modules 
>  Mass storage devices 
>  Automotive electronics 
>  Set top boxes 
>  Audio and video components 

 
Typical Properties of TIF®100-60-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.0 W/m-K ASTM D5470
6.0 W/m-K ISO22007
 
Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W/mK For Heat Transfer In Automotive Electronics 0

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 
The TIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Certifications:


 ISO9001:2015

 ISO14001: 2004 IATF16949:2016

 IECQ QC 080000:2017

 UL  


Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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