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Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems

Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems

Large Image :  Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems

Product Details:
Place of Origin: China,dongguan
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-20-10S
Document: TIF100-20-10S_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day
Detailed Product Description
Product Name: Thermal Gap Filler Designed To Enhance Heat Dissipation And Extend Lifespan Of Electronic Components In Embedded Systems Construction & Compostion: Ceramic Filled Silicone Elastomer
Dielectric Constant @1MHz: 4.7 Application: Enhance Heat Dissipation And Extend Lifespan Of Electronic Components In Embedded Systems
Sample: Sample Free Recommended Operating Temperature (°C): -40 To 200℃
Thermal Conductivity(W/mk): 2.0W/mK Hardness: 65/45 Shore 00
Flame Rating: UL 94 V-0 Keywords: Thermal Gap Filler

Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems


Products description


TIF®100-20-10S Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.


Features


 >Good thermal conductivity
>Good softness and fillability
>Self-adhesive without the need for additional surface adhesives 
>Good insulation performance


Applications


>Home appliance industry
>Power module
>Wearable device
>Solar photovoltaic panel
>LED lighting fixtures

Key attributes

Typical Properties of TIF®100-20-10S Series
Property Value Test method
Colo Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.65 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.7 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 2.0 ASTM D5470
2.0 ISO22007


Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm),with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmx406 mm)


The TIF® series is available in custom shapes andvarious forms.
For other thicknesses or more information, please contact us.

Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems 0

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems 1

Company Profile


Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:


Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel


All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems 2

Independent R&D team


Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.


FAQ


Q: How do I place an order? 

A:1. Click the "Sent messages" button to continue with the process. 

2. Fill out the message form by entering a subject line, and message to us.  

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us 

4. We will reply you as soon as possible with Email or online 


Q: How do I request customized samples? 

A: To request samples, you can leave us message on website, or just contact us by send email or call us. 


Q: What's the thermal conductivity test method given on the data sheet ? 

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity. 


Exhibition desplay 

Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems 3


Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)