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Product Details:
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| Product Name: | High Thermal Conductivity 6.0W Non Silicone Gap Pad For Telecommunication Equipment | Color: | Dark Grey |
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| Thermal Conductivity: | 6.0W/mK | Dielectric Constant: | 9.0 MHz |
| Thickness: | 1.5mmT | Hardness: | 60 Shore00 |
| Density: | 3.3g/cm³ | Keywords: | Non Silicone Gap Pad |
| Application: | Telecommunication Equipment | ||
| Highlight: | non silicone thermal gap pad,high conductivity telecommunication gap filler,6.0W silicone free gap pad |
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The Z-Paster ®100 6060-11 series is a siloxane-free thermally conductive interface material designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates from heat-generating electronic components.
| Property | Value | Test Method |
|---|---|---|
| Color | Dark Gray | Visual |
| Construction | Non-Silicone resin | ***** |
| Thermal Conductivity | 6.0 W/mK | ASTM D5470, ISO 22007 |
| Hardness | 60 Shore 00 | ASTM 2240 |
| Density | 3.3g/cm³ | ASTM D297 |
| Thickness range | 0.040~0.200"/1.00~5.00mm | ASTM D374 |
| Breakdown Voltage | ≥5500 V/mm | ASTM D149 |
| Dielectric Constant @1MHz | 9.0 | ASTM D150 |
| Volume Resistivity | >1.0×10¹² Ohm-meter | ASTM D257 |
| Operating Temperature | -45 ~ 125 ℃ | ***** |
| Flame Rating | V-0 | UL94 (E331100) |
Standard Thickness: 0.040" (1.00 mm)~0.200" (5.00 mm) with increments of 0.010 (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
The Z-paster® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details:
Lead Time:
Quantity: 5000 pieces
Estimated Time: To be negotiated
Contact Person: Dana Dai
Tel: +86 18153789196