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Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

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The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

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Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

Large Image : Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	RoHs
Model Number:	TS-TIR300L

Payment & Shipping Terms:

Minimum Order Quantity:	1000PCS
Price:	0.1-10 USD/PCS
Packaging Details:	1000pcs/bag
Delivery Time:	2-3 work days
Supply Ability:	100000pcs/day

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Detailed Product Description

Product Name:	Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External Casings	Thickness:	0.15mm
Density:	1.4 G/cc	Thermal Conductivity (Z Axis Direction):	2.5W/m-K
Hardness:	90 Shore A	Application:	Between Heat Sinks And External Casings
Color:	Black	Keywords:	Graphite Composite Thermal Pad

Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

TIR^®300L Series is a graphite-enhanced composite thermal interface material engineered forhigh thermal conductivity and reliable heat dissipation.Reinforced with an aluminum foil layer,it maintains structural integrity throughout handling and application. The material conforms well to a variety of surfaces, enabling efficient thermal contact and ease of assembly. lt isideally suited for use between power transistors and heat sinks, as well as in large-areathermal interface applications.

Feature

> Excellent thermal impedance
> Replaces traditional thermal grease

> High reliability
> Easy to apply to surfaces

Application

> Between transistors and heat sinks

> Between mechanical structures

> Between heat sinks and externalcasings

Typical Properties of TIR^®300L series
Product Name	TIR^®300L	Test Method
Colour	Black	Visual
Reinforcement Carrier	Aluminum	*****
Thickness range	0.15 mm	ASTM D374
Hardness	90 Shore 00	ASTM D2240
Density	1.4g/cc	ASTM D792
Volume Resistivity(ohm-cm)	1*10²	ASTM D257
Continuous Use Temperature	-60℃~ 180℃	Ziitek Test Method
Thermal Conductivity(W/mK)	2.5	ASTM D5470
Thermal impedance(℃-in²/W)@30psi	0.3	ASTM D5470
Thermal impedance(℃-in²/W)@50psi	0.25	ASTM D5470
180° Peel Strength	1.0N/25mm	ASTM D3330 (Steel,Immediate)

Packaging Details & Lead time

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

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