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Highly Efficient Thermal Conductivity 8.0 W/MK Heat Resistant Silicone Thermal Pads

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Highly Efficient Thermal Conductivity 8.0 W/MK Heat Resistant Silicone Thermal Pads

Highly Efficient Thermal Conductivity 8.0 W/MK Heat Resistant Silicone Thermal Pads

Large Image :  Highly Efficient Thermal Conductivity 8.0 W/MK Heat Resistant Silicone Thermal Pads

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF7100QE
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Highly Efficient Thermal Conductivity 8.0 W/MK Heat Resistant Silicone Thermal Pads Thermal Conductivity& Compostion: 8.0 W/m-K
Specific Gravity: 3.5g/cc Thickness: 2.5mmT
Color: Gray Continuos Use Temp: -45℃ To 200℃
Hardness: 35±10 Shore 00 Construction: Ceramic Filled Silicone Elastomer
Keywords: Thermal Conductive Pad
Highlight:

Heat Resistant Silicone Thermal Pads

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8.0 W/MK Thermal Pads

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Highly Efficient Thermal Pads

Highly Efficient Thermal Conductivity 8.0 W/MK Heat Resistant Silicone Thermal Pads

 

The TIF7100QE is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


Features:


> Good thermal conductive:8.0W/MK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance


Applications:

 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

Typical Properties of TIF7100QE Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.5g/cc ASTM D297
thickness 2.5mmT ASTM D374
Hardness 35±10 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.5MHz ASTM D150
Volume Resistivity 1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 8.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Sheets Sizes:    
8" x 16"(203mm x 406mm) 
TIF™ series Individual die cut shapes can be supplied. 
Highly Efficient Thermal Conductivity 8.0 W/MK Heat Resistant Silicone Thermal Pads 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)

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