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Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules 

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China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
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The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules 

Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules 
Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules  Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules  Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules 

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF740QE
Document: TIF700QE_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-7work days
Payment Terms: T/T
Supply Ability: 10000/day

Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules 

Description
Products Name: Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules Composition: Ceramic Filled Silicone Elastomer
Thermal Conductivity& Compostion: 8.0 W/m-K Density (g/cm³): 3.4
Thickness: 1.0mmT Color: Gray
Recommended Operating Temperature (°C): -40℃ To 200℃ Hardness (Shore 00): 60/35
Keywords: Thermal Gap Filler Application: Memory Modules
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Product Overview

TIF®740QE Series is a high-end compressible thermal pad engineered to meet top-level cooling requirements while maintaining excellent assembly workmanship. Through an innovative material formulation, it achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by ultra-high heat flux densities, while also providing good mechanical strength and compressibility — making it easy to process and install. It offers a reliable interface material solution with both outstanding thermal performance and high reliability for high-power-density electronic devices.

Key Features
  • Good thermal conductivity: 8.0 W/mK
  • Naturally tacky, requiring no further adhesive coating
  • Soft and compressible for low-stress applications
  • Available in various thicknesses
  • Moldability for complex parts
  • Broad range of hardnesses available
Applications
  • Cooling components to the chassis of frame
  • High-speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
Typical Properties of TIF®700QE Series
Property Value Test Method
Color Gray Visual
Composition Ceramic filled silicone elastomer ZKTM J024
Density (g/cm³) 3.4 ASTM D297
Thickness (inch/mm) 0.010~0.020" / 0.25~0.5 mm
0.030~0.200" / 0.75~5.00 mm
ASTM D374
Hardness (Shore OO) 60 / 35 ASTM 2240
Continuous Use Temp -40 to 200℃ ZKTM J025
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.5 ASTM D150
Volume Resistivity (Ohm-meter) >1.0×10¹² ASTM D257
Fire Rating V-0 UL94 (E331100)
Thermal Conductivity 8.0 W/m-K ASTM D5470
Product Specifications
  • Standard Thickness: 0.010" (0.25 mm) ~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
  • Standard Size: 16" × 16" (406 mm × 406 mm)
Component Codes
  • Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
  • Adhesive Options: A1/A2 (Single-sided / Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF 740QE Series thermal gap filler silicone thermal pad product image

Company Profile

Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). We have rich experience in this field, supporting you with the latest, most effective, one-step thermal management solutions. We operate many advanced production equipment units, full test equipment, and fully automatic coating production lines, which support the production of high-performance thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, thermal grease, and more. Our products are UL94 V-0, SGS, and RoHS compliant.

Our Services
  • Online service: 12 hours; inquiry reply within the fastest time
  • Working time: 8:00 am – 5:30 pm, Monday to Saturday (UTC+8)
  • Well-trained and experienced staff answer all inquiries in English
  • Standard export carton, marked with customer information, or customized packaging
  • Free samples provided
  • After-service: Even though our products have passed strict inspection, if you find parts that cannot work well, please show us the proof. We will help you resolve it and provide a satisfactory solution.

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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