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8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board

Large Image : 8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF™700HQ

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 work days
Supply Ability:	100000pcs/day

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Detailed Product Description

Products Name:	8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board	Construction & Compostion:	Ceramic Filled Silicone Elastomer
Thermal Conductivity:	8.0W/m-K	Hardness:	45±5 Shore 00
Thickness Range:	0.5mmT~5.0mm	Application:	Electronic Component Gap Filling
Operating Temp:	-45~200℃	Keywords:	Thermal Pad
Highlight:	8W/MK Thermal Pad , Mainboard Thermal Pad , Mother Board Thermal Pad

8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board

The TIF™700HQ Series thermally conductive interface materials are applied tofill the air gaps between the heating elements and the heat dissipation finsor the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductivity
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices

Typical Properties of TIF700HQ Series
Color	Gray	Visual
Construction &Compostion	Ceramic filled silicone elastomer	******
Thickness	0.020"(0.5mm)~0.200"(5.0MM)	ASTM D374
Specific Gravity	3.0g/cc	ASTM D792
Hardness	45±5 Shore 00	ASTM 2240
Continuos Use Temp	-45 to 200℃	***
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	5.0 MHz	ASTM D150
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257
Fire rating	94 V0	UL E331100
Thermal conductivity	8.0W/m-K	ASTM D5470

Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Company profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board 0