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2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module

2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module
2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module 2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module

Large Image :  2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: Z-Paster100-20-11S
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 100000pcs/day
Detailed Product Description
Product Name: 2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module Color: Drak Gray
Hardness: 50 Shore 00 Thickness: 0.25mmT~5.0mm
Dielectric Constant: 5.5 MHz Key Words: Silicone Free Thermal Pad
Specific Gravity: 2.65g/cc Thermal Conductivity: 2.0W/mK
Highlight:

Insulation Sheets Thermal Gap Filler

,

Silicone Free Thermal Pad

,

Graphics Card Thermal Pad

2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Z-Paster100-20-11S Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.
The roleis to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. lt applies to the liner based on silicone suitably.The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

Z-Paster100-20-11S-Series-Datasheet-REV01.pdf

 

2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module 0

 

Features

 

> Silicone-free

> ROSH compliance

> Good thermal conductive:2.0W/mK

> Soft and Compressible for low stress applications

> Available in varies thickness

 

Application

 

> Cooling components to the chassis of frame

> Car Battery & Power Supply

> Charging Pile

> Silicone-sensitive applications

> Graphics Card Thermal Module

> Set Top Box

> Medical devices

> LED Lighting

> SFP optical module

> Miniature heat tube radiator

 

Typical Properties of Z-Paster100-20-11S Series
Color Dark gray Visual Dielectric Breakdown Voltage (T= 1mm above) >5000 VAC ASTM D149
Construction Silicone-free The metal oxide fills ********** Dielectric Constant 5.5 MHz ASTM D150
Thermal Conductivity 2.0 W/mK ASTM D5470 Volume Resistivity 6.0X1013 Ohm-meter ASTM D257
Hardness 50 Shore 00 ASTM 2240 Continuous Use Temp – 20 To 125 ℃ **********
Specific Gravity 2.65 g/cc ASTM D297 Outgassing (TML) 0.30% ASTM E595
Thickness 0.020"-0.200"(0.25mm~5.0mm) ASTM D374 Flame Rating 94 V-0 equivalent to

 

Standard size 

0.010-inch to 0.200-inch (0.25mm to 5.0mm)

 

Options

Proprietary NS1 option available to eliminate tack from one side to aid in handling.

 

2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module 1

 

Packaging Details & Lead time

 

The packaging of Silicone free thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)