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3.5mmt Blue Silicone Pads Thermal Conductivity 3.0 W/M-K For Notebook

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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3.5mmt Blue Silicone Pads Thermal Conductivity 3.0 W/M-K For Notebook

3.5mmt Blue Silicone Pads Thermal Conductivity 3.0 W/M-K For Notebook
3.5mmt Blue Silicone Pads Thermal Conductivity 3.0 W/M-K For Notebook
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Large Image :  3.5mmt Blue Silicone Pads Thermal Conductivity 3.0 W/M-K For Notebook

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF1140-30-05US
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Dielectric Breakdown Voltage: 94 V0 Fire Rating: 18 Shore 00
Keyword: Thermal Gap Pad Application: Power Supply
Name: 3.5mmT Low Cost Blue Silicone Pads For Notebook,Thermal Conductivity 3.0 W/m-K Volume Resistivity: 1.0X1012 Ohm-cm
Highlight:

3.5mmt thermal gap filler material

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notebook thermal gap filler material

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gap pad thermal conductivity 3.0 w mk

3.5mmT low cost blue silicone pads for notebook,Thermal conductivity 3.0 W/m-K​

 

     The TIF1140-30-05US  thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

 

TIF100-30-05US-Series-Datasheet.pdf

 

Features

> Good thermal conductive: 3.0 W/mK 

>Thickness:3.5mmT

>hardness:18 shore 00

>Colour: blue

>Outstanding thermal performance

>High tack surface reduces contact resistance

>RoHS compliant

 

 

Applications

>mainboard/mother board

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

 

Typical Properties of TIF1140-30-05US Series
Color
blue
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.0g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
3.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
18 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 

 

 

 

 

 

 

 

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

3.5mmt Blue Silicone Pads Thermal Conductivity 3.0 W/M-K For Notebook 0

 

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Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

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