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4.0mm 94 V0 Silicon Heat Sink Pad For CD-Rom DVD-Rom Cooling 2.6w

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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4.0mm 94 V0 Silicon Heat Sink Pad For CD-Rom DVD-Rom Cooling 2.6w

4.0mm 94 V0 Silicon Heat Sink Pad For CD-Rom DVD-Rom Cooling 2.6w
4.0mm 94 V0 Silicon Heat Sink Pad For CD-Rom DVD-Rom Cooling 2.6w
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF™5160US Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Construction & Compostion: Ceramic Filled Silicone Rubber Thermal Conductivity: 2.6W/m-K
Hardness: 18 Shore 00 Specific Gravity: 2.95 G/cc
Continuos Use Temp: -40to 160℃ Dielectric Breakdown Voltage: >5500 VAC
Colour: Violet Thickness: 4.0mmT
High Light:

CD-Rom Heat Sink Pad

,

94 V0 Silicone Heat Sink Pad

,

2.6w Silicone Heat Sink Pad

Special designed 4.0mm 94 V0 Silicon heat sink pad For CD-Rom, DVD-Rom cooling 2.6w

     
The TIF™5160US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
 
 

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

Features

>  Good thermal conductive: 2.6W/mK 
> Thickness:4.0mmT
> UL recognized
> RoHS compliant
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance
 
Applications

>  Cooling components to the chassis of frame  
>mainboard/mother board
>  High speed mass storage drives
>CD-Rom, DVD-Rom cooling
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive electronics
>  Telecommunication hardware
>  Handheld portable electronics
> Semiconductor automated test equipment (ATE)
 
Typical Properties of TIF™5160US Series
Color

Violet

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm0.36
20mils / 0.508 mm0.41
Specific Gravity
2.95 g/ccASTM D297

30mils / 0.762 mm

0.47

40mils / 1.016 mm

0.52
Thickness
4.0mmT***

50mils / 1.270 mm

0.58

60mils / 1.524 mm

0.65

Hardness
18 Shore 00ASTM 2240

70mils / 1.778 mm

0.72

80mils / 2.032 mm

0.79
Tensile Strength

45 psi

ASTM D412

90mils / 2.286 mm

0.87

100mils / 2.540 mm

0.94
Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.01 

120mils / 3.048 mm

1.09 
Dielectric Breakdown Voltage
>5500 VACASTM D149

130mils / 3.302mm

1.17

140mils / 3.556 mm

1.24
Dielectric Constant
4.3 MHzASTM D150

150mils / 3.810 mm

1.34

160mils / 4.064 mm

1.42
Volume Resistivity
4.2X1013 Ohm-meterASTM D257

170mils / 4.318 mm

1.50

180mils / 4.572 mm

1.60
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.68

200mils / 5.080 mm

1.77
Thermal conductivity
2.6 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
 

 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 
Consult the factory to alternate thickness.
 

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

 
TIF™ series Individual die cut shapes can be supplied

 
4.0mm 94 V0 Silicon Heat Sink Pad For CD-Rom DVD-Rom Cooling 2.6w 0
 

Advantage
 
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.
 
Ziitek Culture
 
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
 
 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)