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High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification

The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU

Large Image : High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU

Product Details:

Place of Origin:	China
Brand Name:	ZIITEK
Certification:	UL and RoHs
Model Number:	TIF180-02F

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	negotiation
Packaging Details:	1000pcs/bag
Delivery Time:	3-5 days
Payment Terms:	T/T
Supply Ability:	100000pcs/day

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Detailed Product Description

Products Name:	High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU	Hardness:	60 Shore 00
Thickness:	2.0mmT	Specific Gravity:	2.3g/cc
Construction:	Ceramic Filled Silicone Elastomer	Thermal Condutivity:	1.5W/mK
Application:	Laptop Graphics Card CPU GPU	Keywords:	Thermal Conductive Silicone Pad
Highlight:	Thermal Conductive Silicone Pad 2.0mmT , DVD-Rom Cooling Thermal Conductive Silicone Pad , UL Silicone Thermal Pad

High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

The TIF180-02F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipationfins or the metal base.Their flexibility and elasticity make them suited tocoat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

High Efficient Thermal Conductivity Thermal Conductive Silicone Pad For Laptop Graphics Card CPU GPU 0
Features:
> Good thermal conductivity: 1.5 W/mK

> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness

Application

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

Typical Properties of TIF180-02F Series
Color	Gray	Visual	Composite Thickness	hermalImpedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.48
			20mils / 0.508 mm	0.56
Specific Gravity	2.3 g/cc	ASTM D297	30mils / 0.762 mm	0.71
			40mils / 1.016 mm	0.80
Heat Capacity	1 l/g-K	ASTM C351	50mils / 1.270 mm	0.91
			60mils / 1.524 mm	0.94
Hardness	60 Shore 00	ASTM 2240	70mils / 1.778 mm	1.05
			80mils / 2.032 mm	1.15
Tensile Strength	40 psi	ASTM D412	90mils / 2.286 mm	1.25
			100mils / 2.540 mm	1.34
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	1.43
			120mils / 3.048 mm	1.52
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.63
			140mils / 3.556 mm	1.71
Dielectric Constant	4.5 MHz	ASTM D150	150mils / 3.810 mm	1.81
			160mils / 4.064 mm	1.89
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257	170mils / 4.318 mm	1.98
			180mils / 4.572 mm	2.07
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	2.14
			200mils / 5.080 mm	2.22
Thermal conductivity	1.5 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Product Thicknesses:

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes:

8" x 16"(203mm x4O6mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

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4. We will reply you as soon as possible with Email or online.

Tag:

thermal conductive material,

thermally conductive pad,

cpu thermal pad

Contact Details

Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

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