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Gray Compressible Thermally Conductive Heat Sink Cooling Pad For Memory Modules 

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Gray Compressible Thermally Conductive Heat Sink Cooling Pad For Memory Modules 

Gray Compressible Thermally Conductive Heat Sink Cooling Pad For Memory Modules 
Gray Compressible Thermally Conductive Heat Sink Cooling Pad For Memory Modules 
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF160-02F
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Payment Terms: T/T
Supply Ability: 100000pcs/day
Detailed Product Description
Products Name: Gray Compressible Thermally Conductive Heat Sink Cooling Pad For Memory Modules Thickness: 1.5mmT
Fire Rating: 94-V0 Color: Gray
Outgassing(TML): 0.35% Specific Gravity: 2.3g/cc
Hardness: 60 Shore 00 Keywords: Thermal Grease
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Thermal Conductive Pad 1.5mmT

Gray Compressible Thermally Conductive Heat Sink Cooling Pad For Memory Modules
 

With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


The TIF160-02F Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or themetal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Gray Compressible Thermally Conductive Heat Sink Cooling Pad For Memory Modules  0
Features:

 

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating

 
Applications

 

> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp

 

 

Typical Properties of TIF160-02F Series
Color

gray

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
*** 10mils / 0.254 mm

0.48

20mils / 0.508 mm

0.56

Specific Gravity

2.3 g/cc

ASTM D297

30mils / 0.762 mm

0.71

40mils / 1.016 mm

0.80

Thickness range 0.020"(0.5mm) to 0.200"(5.0mm) ASTM C351

50mils / 1.270 mm

0.91

60mils / 1.524 mm

0.94

Hardness
60 Shore 00 ASTM 2240

70mils / 1.778 mm

1.05 

80mils / 2.032 mm

1.15 

Tensile Strength
 

40 psi

ASTM D412

90mils / 2.286 mm

1.25 

100mils / 2.540 mm

1.34 

Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.43   

120mils / 3.048 mm

1.52   

Dielectric Breakdown Voltage
>5500 VAC ASTM D149

130mils / 3.302mm

1.63

140mils / 3.556 mm

1.71

Dielectric Constant
4.0 MHz ASTM D150

150mils / 3.810 mm

1.81

160mils / 4.064 mm

1.89
Volume Resistivity
1.0X10¹² Ohm-meter ASTM D257

170mils / 4.318 mm

1.98

180mils / 4.572 mm

2.07 

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.14 

200mils / 5.080 mm

2.22 

Thermal conductivity
1.5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

Standard Thicknesses:           
0.010" (0.25mm),0.020" (0.51mm),0.030" (0.76mm),0.040" (1.02mm),
0.050" (1.27mm),0.060" (1.52mm),0.070" (1.78mm),0.080" (2.03mm),
0.090" (2.29mm),0.100" (2.54mm),0.110" (2.79mm),0.120" (3.05mm),
0.130" (3.30mm),0.140" (3.56mm),0.150" (3.81mm),0.160" (4.06mm),
0.170" (4.32mm),0.180" (4.57mm),0.190" (4.83mm),0.200" (5.08mm)
Consult the factory alternate thickness.

Standard thicknesses:
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
 

Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:                     
TIF™ series sheets type can add with fiberglass reinforced.
 
Gray Compressible Thermally Conductive Heat Sink Cooling Pad For Memory Modules  1
 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)