Product Details:
Payment & Shipping Terms:
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Thermal Conductivity: | 12 W/mK | Application: | Wireless Router |
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Dielectric Breakdown Voltage: | >5500 VAC | Name: | TIF850HP |
Feature: | Ultra Soft | Keywords: | Thermal Gap Filler Pad |
Highlight: | thermally conductive filler,thermal conductivity silicone,Ultra Soft Thermal Gap Filler |
12 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad
The TIF850HP thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 12 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies size
> Thickness: 1.25mmT
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF850HP
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Color
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Gray | Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
Construction &
Compostion |
Ceramic filled silicone rubber
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*** | 10mils / 0.254 mm |
0.57 |
20mils / 0.508 mm |
0.71 |
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Hardness(Shore00 Thickness ≥0.75mm) |
40 |
ASTM D297 |
30mils / 0.762 mm |
0.88 |
40mils / 1.016 mm |
0.96 |
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Hardness(Shore00 Thickness <0.75mm)
|
65 |
ASTM C351 |
50mils / 1.270 mm |
1.11 |
60mils / 1.524 mm |
1.26 |
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Density(g/cm3)
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3.55 | ASTM 2240 |
70mils / 1.778 mm |
1.39 |
80mils / 2.032 mm |
1.54 |
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Thickness range
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0.030''~0.200'' |
ASTM D412 |
90mils / 2.286 mm |
1.66 |
100mils / 2.540 mm |
1.78 |
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Continuos Use Temp
|
-40 to 160℃ |
*** |
110mils / 2.794 mm |
1.87 |
120mils / 3.048 mm |
1.99 |
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Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
130mils / 3.302mm |
2.12 |
140mils / 3.556 mm |
2.22 |
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Dielectric Constant
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4.5 MHz | ASTM D150 |
150mils / 3.810 mm |
2.31 |
160mils / 4.064 mm |
2.41 |
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Volume Resistivity | 1.0X1012 Ohm-meter |
ASTM D257 |
170mils / 4.318 mm |
2.51 |
180mils / 4.572 mm |
2.58 |
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Fire rating
|
94 V0 |
equivalent UL |
190mils / 4.826 mm |
2.64 |
200mils / 5.080 mm |
2.72 |
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Thermal conductivity
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12 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Contact Person: Miss. Dana
Tel: 18153789196